Printed electronic switch on flexible substrates using printed microcapsules

Cate, A. Tessa ten; Gaspar, Cristina; Virtanen, Heini; Stevens, Ralph; Koldeweij, Robin B. J.; Olkkonen, Juuso; Rentrop, Corné; Smolander, Maria

doi:10.1007/s10853-014-8271-7

Cited by 15 publications

(6 citation statements)

References 24 publications

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“…One advantage of printed technology compared to conventional photolithography-driven electronics is the relative simplicity of fabrication . Within the past decade, the field of printed electronics has made rapid strides in both low- and high-performance domains like flexible displays, smart labels, decorative paints, antennas, radiofrequency identification devices, fuel cells, sensors, , solar cells, thin-film transistors (TFTs), , and multilayer ceramic capacitors . Different techniques are commonly adopted for imprinting conducting, semiconducting, and dielectric inks onto various substrates, such as screen-printing, ink-jet-printing, and gravure printing .…”

Section: Introductionmentioning

confidence: 99%

Formulation of Sol–Gel Derived Bismuth Silicate Dielectric Ink for Flexible Electronics Applications

Pullanchiyodan

Surendran

2016

Ind. Eng. Chem. Res.

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An agile formulation for the development of a low dielectric constant ink of nanostructured bismuth silicate (nBSO), synthesized by sol-gel method, was demonstrated. The viscous screen printable ink was formulated by controlling the organic additives. The viscosity, as well as dynamic viscoelastic properties of the formulated ink, was suitably tuned, to yield ideal flow characteristics. Microstructure and surface roughness of the printed film were characterized, and the film shows a minimum surface roughness values (Ra = 80.3 nm and Rq = 102 nm).Microwave dielectric properties of the printed dielectric film were ɛ r = 4.36 and tanδ = 1.6×10 -2 at 10 GHz. The apparent leakage current density of the film is of the order of 10 -5 A/cm 2 . The improved dielectric and thermal properties, combined with low leakage current makes nBSO dielectric ink a suitable candidate for printed electronics.

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Section: Introductionmentioning

confidence: 99%

Formulation of Sol–Gel Derived Bismuth Silicate Dielectric Ink for Flexible Electronics Applications

Pullanchiyodan

Surendran

2016

Ind. Eng. Chem. Res.

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“…These conductive fillers include carbon-based conductors (like single-walled carbon nanotubes (SWCNTs), graphene, graphite, carbon fiber), metal-based (gold (Au), silver (Ag), copper (Cu), aluminum (Al)) and organic conductive polymers (PEDOT: PSS, PANi, polypyrrole (PPy)) [22]. In recent studies, silver is utilized as a conductive filler of various geometrical shapes and sizes like powder, wires, flakes and particles, in the formation of stretchable conductive ink because it possesses high electrical conductivity (6.3 x 10 7 Ω -1 m -1 ) [23][24][25][26] and remains conductive after atmospheric exposure than the other metallic fillers like copper and aluminum whose electrical conductivity decreases after reacting with oxygen [23,24]. Apart from the conductive filler, selection of the binder is also very important to produce the desired conductivity as it helps to connect the elements of conductive filler with each other.…”

Section: Introductionmentioning

confidence: 99%

Mechanical Analysis and Constitutive Modeling of Nonlinear Behavior of Silver-based Conductive Ink

S. Zulfikar,

Saad,

Z. Ahmad

et al. 2023

Int. J. Automot. Mech. Eng.

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Stretchable electronic devices are progressively deployed in many applications of mechanical, electrical, and bio-medical engineering. These circuits are made of stretchable and flexible substrate, as well as conductive ink, and various electronic components. The choice of components and layouts for the substrate and conductive ink can regulate the stretchability of stretchable circuits. On top of that, the substance utilized to create the conductive ink must have high electrical conductivity and strong adherence to the substrate in order to produce a high-quality stretchable printed circuit. Thus, this study focused on the development of stretchable conductive ink using silver powder as a conductive filler and PDMS-OH as a binder. The mechanical properties of the synthesized ink were investigated via simple uniaxial tensile testing method and nanoindentation technique, respectively. Accordingly, the modulus of elasticity, tensile stress and yield stress of the ink were obtained as 5.72 MPa, 1.195 MPa, and 0.86 MPa, congruently at 137% strain before undergoing failure. The experimental stress-strain data was then employed on the elastic-plastic constitutive model to investigate the elastomeric properties of the ink as it is an alternative method of lengthy and expensive procedures of validating different polymers. Moreover, the hardness and reduced modulus of the ink were evaluated by nanoindentation method using 5 mN maximum load with 0.5 mN/s loading/unloading rate and 2 secs holding time. Consequently, the hardness and reduced modulus values were obtained as 1.45 MPa and 34.53 MPa, respectively. These values were further validated by Oliver-Pharr method, and were in a good agreement.

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“…Polymeric microcapsules as containers/carriers can be used for self-healing coating, − sensors, , phase change materials, controlled release of drugs and pesticides, − pressure-sensitive switches, displays or smart windows, , optical materials, enzyme immobilization, and fragrances . Microcapsules can protect active cargoes against environmental hazards (such as moisture, oxidation, and bacteria) and thus increase their shelf life .…”

Section: Introductionmentioning

confidence: 99%

In Situ Fabrication of Polymeric Microcapsules by Ink-Jet Printing of Emulsions

Deng

Wang

Yang

2019

ACS Appl. Mater. Interfaces

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Phase separation driven by solvent evaporation of emulsions can be used to create polymeric microcapsules. The combination of emulsion solvent evaporation with ink-jet printing allows the rapid fabrication of polymeric microcapsules at a target location on a surface. The ink is an oil-in-water emulsion containing in the disperse phase a shell-forming polymer, a coreforming fluid that is a poor solvent for the polymer, and a low-boiling good solvent. After the emulsion is printed onto the substrate, the good solvent evaporates by diffusion through the aqueous phase and the polymer and poor solvent phase separate to form microcapsules. The continuous aqueous phase contains polyvinyl alcohol that serves as an emulsifier and as a binder of the capsules to the substrate. This method is demonstrated for microcapsules with various shellforming polymers (PS, PMMA and PLLA) and core-forming poor solvents (hexadecane and a 4heptanone/sunflower oil mixture). Cargoes such as fluorescent dyes (Nile Red and tetracyanoquinodimethane) or active ingredients (e.g. the fungicide tebuconazole) can be encapsulated. Uniform microcapsules are obtained by printing emulsions containing monodisperse 2 oil droplets produced in a microfluidic device. We discuss the physical parameters that need to be controlled for the successful fabrication of microcapsules in inkjet printing. The method for rapid, in-situ encapsulation could be useful for controlled-release applications including agrochemical sprays, fragrances, functional coatings and topical medicines.

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Printed electronic switch on flexible substrates using printed microcapsules

Cited by 15 publications

References 24 publications

Formulation of Sol–Gel Derived Bismuth Silicate Dielectric Ink for Flexible Electronics Applications

Formulation of Sol–Gel Derived Bismuth Silicate Dielectric Ink for Flexible Electronics Applications

Mechanical Analysis and Constitutive Modeling of Nonlinear Behavior of Silver-based Conductive Ink

In Situ Fabrication of Polymeric Microcapsules by Ink-Jet Printing of Emulsions

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