Printing conformal electronics on 3D structures with Aerosol Jet technology

Paulsen, J. A.; Renn, Michael J.; Christenson, K. K.; Plourde, Richard

doi:10.1109/fiiw.2012.6378343

Cited by 181 publications

(106 citation statements)

References 4 publications

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“…It enables precision high-aspect-ratio material deposition for a variety of scientific and industrial applications (cf. Hedges, 2007;Kahn, 2007;Renn et al, 2010;Christenson et al, 2011;Paulsen et al 2012). For well-controlled high-precision material deposition, the mist flow impacting on substrate is maintained in the steady laminar regime for Aerosol Jet ® printing.…”

Section: Introductionmentioning

confidence: 99%

A Computational Study of Particle Deposition Patterns from a Circular Laminar Jet

Feng

2017

JAFM

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To gain insights into ink material deposition behavior during Aerosol Jet® printing, particle deposition patterns on the plate of inertial impactor with circular laminar jet are investigated numerically with a lagrangian solver implemented within the framework of the OpenFOAM® CFD package. Effects of taper angle of the nozzle channel and jet-to-plate distance are evaluated. The results show quite different particle deposition patterns between tapered nozzle and straight nozzle. At jet Reynolds number Re = 1132, a tapered nozzle deposits particles to form a pattern with a high density ring toward the deposition spot edge, especially when the particle Stokes number St > St50, which is absent with a straight nozzle. Increasing the jet-to-plate distance tends to reduce such particle density peak. Reducing Re to 283 yields particle deposition patterns without the high density ring near the spot edge, with the same tapered nozzle. The particle deposition patterns with the straight nozzle at Re = 283 exhibit further reduced particle density around the spot edge such that the particle density profile appears more like a Gaussian function. In general, the effect of reducing Re on particle deposition pattern seems to be similar to increasing the jet-to-plate distance. The computed particle deposition efficiency η shows the fact that those particles around the jet axis, even with very small values of St, always impact the center of plate, as indicated by the nonvanishing value of η with substantial reduction of St. Such a "small particle contamination" typically amounts to ~10% of small particles (with St < 0.1) at Re ~ 1000 and ~5% at Re ~ 300, which may not be negligible in data analysis with inertial impactor measurement.

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Section: Introductionmentioning

confidence: 99%

A Computational Study of Particle Deposition Patterns from a Circular Laminar Jet

Feng

2017

JAFM

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“…Various electromagnetic devices have been developed using 3D‐printing methods include transmission lines, microstrip filters, sensors, waveguides, resonators, antenna pads, and frequency selective surfaces . So far these devices are fabricated using the 2‐step process requiring not just 3D printers, but specialty extrusion and curing methods for the conductive inks . Hence there is a need for a 1‐step processes in which both dielectric and conductive features of microwave devices are 3D printed using dielectric and conductive filaments.…”

Section: Introductionmentioning

confidence: 99%

One‐step 3D‐printing process for microwave patch antenna via conductive and dielectric filaments

Hasni

Green

Filippas

et al. 2018

Micro & Optical Tech Letters

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3D printing is becoming increasingly popular due to its convenience, ease of use, and low cost. Companies such as Ford, General Electric Aviation, and many others are using 3D printing for rapid prototyping before investing time and money in volume manufacturing. However, development in 3D‐printed microwave antennas has remained limited. In this study, a parametric analysis of solely (one step process) 3D‐printed 5.8 GHz patch antennas using commercially available conductive and dielectric materials is presented. Effects of tool path and layer resolution on the substrate material's complex permittivity and radiative material's conductivity are explored. These antennas will utilize commercially available conductive PLA filament (Black Magic) based on graphene as the material for the radiating elements and ground plane. Dielectric PLA will be used in place of the substrate.

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“…Finally, the SMD interconnections have a low standoff that could potentially impact the mechanical reliability. In 2012, Optomec and Stratasys demonstrated the manufacture of an unmanned aerial vehicle by printing conductors onto a 3D printed plastic part to generate the electric power for the propeller engine and also to print functional strain gauges [7].…”

Section: Introductionmentioning

confidence: 99%

Enabling Rapid Production and Mass Customisation of Electronics Using Digitally Driven Hybrid Additive Manufacturing Techniques

Wasley

Kay

et al. 2016

2016 IEEE 66th Electronic Components and Technology Conference (ECTC)

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Abstract-Additive Manufacturing processes can facilitate the rapid iterative product development of electronic devices by optimising their design and functionality. In addition, these methods present a number of potential advantages for improving the production speed and complexity of mass customised and bespoke electronics. In this paper, we present a new digitally driven hybrid fabrication process chain, capable of producing functional, multilayer electronics embedded within geometrically complex 3D printed structures. This has been achieved by interleaving stereolithography, micro-dispensing and surface mount assembly. The resultant combination of different template-less manufacturing techniques enables both the formation of multi-material circuits (conductors and dielectrics) and where the package housing encapsulates the electronics and forms part of the final 3D device. This paper also details the developments around depositing novel freestanding z-axis interconnects. A 555 timer circuit with flashing LED manufactured within a 3D pyramid was used as a demonstrator. The demonstrator contained circuits with feature sizes down to 170 m, and packaged components of 0603 size, a Small Outline Integrated Circuit (SOIC) and a SMD LED. In addition, flip chip packaging on 3D printed substrates has been demonstrated.

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Printing conformal electronics on 3D structures with Aerosol Jet technology

Cited by 181 publications

References 4 publications

A Computational Study of Particle Deposition Patterns from a Circular Laminar Jet

A Computational Study of Particle Deposition Patterns from a Circular Laminar Jet

One‐step 3D‐printing process for microwave patch antenna via conductive and dielectric filaments

Enabling Rapid Production and Mass Customisation of Electronics Using Digitally Driven Hybrid Additive Manufacturing Techniques

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