Printing Solder Paste in Dry Film - A Low Cost Fine-Pitch Bumping Technique

Baumgärtner, Tobias; Manessis, D.; Topper, Michael J.; Hauck, Karin; Ostmann, A.; Reichl, H.; Jorge, P.G.C.T.; Yamada, Hiroshi

doi:10.1109/eptc.2007.4469704

Cited by 10 publications

(2 citation statements)

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“…Also, other bumping methods such as solder jetting and microball placement have been discussed in literature [3], [4]. Because it is difficult to fabricate fine-patterned stencil masks and to control the paste volume that comes out of the small aperture, conventional stencil printing was limited to have minimum pitch around 50-100 μm [1], [5]. Consequently, electroplating received more attention recently among various bumping mechanisms owing to its fine-pitch capability.…”

Section: Introductionmentioning

confidence: 99%

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Characterization and Estimation of Solder-on-Pad Process for Fine-Pitch Applications

Lee

Eom

Bae

et al. 2014

IEEE Trans. Compon., Packag. Manufact. Technol.

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Popular solder-bumping mechanisms such as electroplating and stencil printing suffer from either high process costs or technical limitations. A low-cost solder-on-pad (SoP) process has been developed to meet the requirements of fine-pitch solder bumping. This paper focuses on the characterization and estimation of the SoP process. To form a solder bump without soldering defects, optimum process conditions should be carefully designed. A model to estimate the bump volume and predict the bump height is suggested. By optimizing the composition of solder paste material called solder-bump-maker, and by adjusting the process conditions, Sn-Ag-Cu solder bumps with different heights are obtained. The experiments and analysis to understand the impact of parameters were based on test vehicles with 80 μm pitch size. Then, the measured heights of solder bumps are compared with the model to see how they fit the estimation. Finally, a similar process has been conducted to test vehicles with pitch sizes of 150 and 40 μm, to confirm the scalability of the SoP process in different pitch sizes.

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Section: Introductionmentioning

confidence: 99%

“…Moreover, the electroplating has a low flexibility in choosing solder alloys [3], [5]. Electroplating of ternary alloys such as Sn-Ag-Cu requires a complex process which leaves no option for electroplating but to choose a single-or double-compound solder alloys [5].…”

Section: Introductionmentioning

confidence: 99%