Wafer Level Chip Scale Packaging

Topper, Michael J.

doi:10.1007/978-0-387-78219-5_16

Cited by 15 publications

(2 citation statements)

References 20 publications

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“…Structures that are highly reliable in solder based bumping applications usually require nickel thickness in the range of 3µm to 5µm [5]. Numerous reports have been published on the importance of bump height in ENIG [6,7] but lack of relationship between the process parameters. In this work, an ENIG design of experiment (DOE) is conducted to investigate the behaviour of the self patterning process in ENIG bump formation by varying its chemical bath temperature while time is set to a lower time compared to the control process time.…”

Section: Introductionmentioning

confidence: 99%

Chemical Bath Temperature Investigation for Electroless Nickel Immersion Gold

Retnasamy

Sauli

Hashim

et al. 2014

AMR

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Conventional gold wire bonding to alunimium bond pads leads to the formation of intermetallic compound. Electroless Nickel Immersion Gold (ENIG) has been proposed as surface finish for aluminium bond pads to improve high temperature reliability. In order to create acceptable solder bumps prior to reflow process, a particular bump height for ENIG bumps need to be obtained. This paper reports the effects of chemical bath temperature in response to the bump height using a shorter process time. Analysis was done by using a design of experiment (DOE). The results suggest that higher temperature increases the bump height. Electroless nickel temperature has more influence to the bump height compared to immersion gold temperature.

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Section: Introductionmentioning

confidence: 99%

Chemical Bath Temperature Investigation for Electroless Nickel Immersion Gold

Retnasamy

Sauli

Hashim

et al. 2014

AMR

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“…With the bump density increasing, the effective photoresist removal, especially for dry-film photoresist removal, becomes a major challenge. Many scientists and engineers have been working at initiative stripper and process development to address it (1,2,3,4,5).…”

Section: Introductionmentioning

confidence: 99%

Development of Alkaline Solvent Stripper for Wafer Level Package

et al. 2013

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In this paper, the advantage and limitation of different alkali photoresist stripper is reviewed. Different from traditional dry film stripper, tetramethyl ammonium hydroxide is adopted to replace potassium hydoxide as an etchant to prevent precipitation. In details, the substrate protection, such as Al, Cu, Ag and Sn, is studied, and angstrom level etch rate is received with the carefullydesigned inhibitor system; Secondly, the effective photoresist removal performance is acheived with the components balance; In the end, the cleaning mechanism and capability of this novel photoresist removal stripper are disclosed.

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Bumping Technologies

Topper¹,

Lu²

2013

Advanced Flip Chip Packaging

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Wafer Level Chip Scale Packaging

Cited by 15 publications

References 20 publications

Chemical Bath Temperature Investigation for Electroless Nickel Immersion Gold

Chemical Bath Temperature Investigation for Electroless Nickel Immersion Gold

Development of Alkaline Solvent Stripper for Wafer Level Package

Bumping Technologies

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