2016
DOI: 10.1063/1.4970984
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Probing the effect of point defects on the leakage blocking capability of Al0.1Ga0.9N/Si structures using a monoenergetic positron beam

Abstract: Articles you may be interested inProbing the effect of point defects on the leakage blocking capability of Al 0.1 Ga 0.9 N/Si structures using a monoenergetic positron beam ) were grown on Si substrates by metalorganic vapor phase epitaxy. The major defect species in Al 0.1 Ga 0.9 N was determined to be a cation vacancy (or cation vacancies) coupled with nitrogen vacancies and/or with carbon atoms at nitrogen sites (C N s). The charge state of the vacancies was positive because of the electron transfer from th… Show more

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Cited by 16 publications
(20 citation statements)
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“…As reported in Ref. [23], a denser [C] in GaN films improves the leakage current. These experimental facts indicate that DD-rich semi-insulating GaN is preferable for AlGaN/GaN-HFETs, because such GaN can prevent both current collapse and buffer leakage.…”
Section: Simulations and Experimentssupporting
confidence: 65%
See 1 more Smart Citation
“…As reported in Ref. [23], a denser [C] in GaN films improves the leakage current. These experimental facts indicate that DD-rich semi-insulating GaN is preferable for AlGaN/GaN-HFETs, because such GaN can prevent both current collapse and buffer leakage.…”
Section: Simulations and Experimentssupporting
confidence: 65%
“…Reference [23] reports that highly C-doped Al 0.1 Ga 0.9 N buffers reduce vertical leakage current. As discussed above, a high C doping changes the deep-level states in GaN, and we investigated the vertical leakage of our samples.…”
Section: Simulations and Experimentsmentioning
confidence: 99%
“…Similar phenomena were reported for carbon-doped GaN and AlGaN grown on Si. [43,44] Since positrons are attracted or repelled by vacancy-type defects through Coulomb forces, the transition of the charge state of vacancy-type defects (V) from positive to neutral (or neutral to negative), V þ ! V 0 (or V 0 !…”
Section: Carrier Trapping By Vacancy-type Defects In Mg-implanted Ganmentioning
confidence: 99%
“…According to the results above, we can find that the difference in our work is that: (1) We find and clarify that the leakage mechanisms are different in the low and high bias ranges, and (2) we show a comparative study for AlGaN/GaN HEMTs on both p-type and n-type substrates with low resistivity, while the literatures show the case of buffer only on both substrates. [11] AlN/Si n + , p + n, p SCLC, VRH, and TAT models [12] GaN-on-Si p Low resistivity SCLC model [14] GaN-to-Si p Low resistivity (i) weak inversion in AlN/Si interface (ii) impact ionization in Si (iii) electron injection from Si into the Buffer [19] GaN-on-Si p (i) carrier injection from an inversion channel (ii) PF conduction [20] GaN-on-Si p PF conduction [21] (Al)GaN-on-Si PF conduction (>200 V) [22] GaN-on-Si n High resistivity a combination of PF and hopping conduction [23] (Al)GaN-on-Si p + n +…”
Section: Resultsmentioning
confidence: 99%