2013
DOI: 10.1063/1.4794900
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Procedure of removing polymer residues and its influences on electronic and structural characteristics of graphene

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Cited by 92 publications
(100 citation statements)
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“…Firstly, the use of vacuum, high temperature environment as well as the time consuming and challenging multiple transfer procedures from metal to transparent substrate makes the CVD-grown graphene very expensive [21,22]. Secondly, the multiple transfer steps increase the possibility of film damage or polymer residue which dramatically decreases the turnoff ratio and elevates further the cost of the product [23,24]. Another alternative candidate is reduced graphene oxide (RGO) with a similar structure to graphene, which has been considered as one promising, low-cost, and easily up-scalable alternative towards graphene-based films [25].…”
Section: Introductionmentioning
confidence: 99%
“…Firstly, the use of vacuum, high temperature environment as well as the time consuming and challenging multiple transfer procedures from metal to transparent substrate makes the CVD-grown graphene very expensive [21,22]. Secondly, the multiple transfer steps increase the possibility of film damage or polymer residue which dramatically decreases the turnoff ratio and elevates further the cost of the product [23,24]. Another alternative candidate is reduced graphene oxide (RGO) with a similar structure to graphene, which has been considered as one promising, low-cost, and easily up-scalable alternative towards graphene-based films [25].…”
Section: Introductionmentioning
confidence: 99%
“…In general, polydimethylsiloxane (PDMS) [16] is used for the dry transfer process, and poly(methyl methacrylate) (PMMA) [15], for the wet transfer process. These protective layers can be removed by heat treatment after the transfer [17][18][19]. However, if a flexible substrate is used as the target substrate, high-temperature heat treatment cannot be applied, and thus, there is no choice but to perform chemical surface treatment using an organic solvent [20].…”
Section: Introductionmentioning
confidence: 99%
“…The Dirac voltage (V BG, Dirac ) of the back-gate device before processing is V BG, Dirac = 49 V, showing a heavy p-doped effect. For the graphene FETs fabricated on Si/SiO 2 substrates, the pdoping of graphene is more easily obtained than n-doping, except for the charge transfer from neighboring adsorbates (such as H 2 O/O 2 molecules) [27] and resist residues [28] on the graphene surface, the silanol groups (Si-OH) with high polarization and other adsorbates on the surface of SiO 2 will also introduce the heavy p-doping of graphene sheet, resulting from the charge transfer [29][30][31].…”
mentioning
confidence: 99%