Process design of Cu(Sn) alloy deposition for highly reliable ultra large-scale integration interconnects

Material Consideration on Ta, Mo, Ru, and Os as Glue Layer for Ultra Large Scale Integration Cu Interconnects

“…These samples were annealed in a rapid thermal annealing (RTA) furnace (equipped with a turbo-molecular pump) in a H 2 (400 Pa) ambient to accelerate the agglomeration of Cu. 19,20) The adhesion of Cu to the glue layer was evaluated by two methods. First, the wettability of Cu on glue layer was measured by the degree of agglomeration of Cu after annealing at 550 C for 30 min.…”

“…The adhesion of Cu to these elements was experimentally evaluated on the basis of the agglomeration behaviors of Cu after annealing at 550 C, and by measuring the wetting angle of Cu on substrates. 16,19,20) The hcp materials having lower lattice misfit values showed better adhesion characteristics than the bcc materials. These results suggest that our lattice misfit concept can be applied to selecting the best glue layer material.…”

Systematic corrosion investigation of various Cu–Sn alloys electrodeposited on mild steel in acidic solution: Dependence of alloy composition

“…The variations of tin composition significantly affect and improve the alloy characteristics and mechanical properties [1], such as ductility, solderability [2], low surface tension [3] and increasing of Sn content provides a higher corrosion resistance. The electroplated Cu-Sn alloys are used for decorative finishing of various metallic articles [4], industrially for metal coatings and microelectronic applications [5,6]. Because of these outstanding characteristics, it is very important to determine the corrosion behaviours of Cu-Sn alloys for improving their stability and performance [7].…”

The effect of chromium dopant on the microstructure and mechanical properties of sputter-deposited copper films

“…First, contrary to the results in Ref. [4], some studies reveal that the additive of Ag or Sn impairs the thermal stability of Cu films due to the decrease of the melting temperature [13,14]. Besides, the reported resistivities of Cu alloy films vary from each another [15].…”