markets for the more mature technologies, and research for the emerging technologies, are increasing year by year. Among these are organic, metal oxide, and organo-hybrid perovskite semiconductor transistor, light-emitting diode, and solar cell-based systems. [1][2][3][4] Large-area optoelectronics is developed on rigid (mainly on glass) and flexible (mainly on plastic such as polyethylene terephthalate, PET) substrates [5] with other types of substrates also being investigated such as paper, [6,7] flexible glass, [8] or textiles. [9] Organic lightemitting diodes (OLEDs), for example, are today one of the most commercialized technologies especially in small-display markets (e.g., smartphone displays) where they now take a major share of the market. In research laboratories, perovskite solar cells (PSC) have seen a huge interest reaching certified record efficiencies of 25.2% at standard test conditions (Air mass AM1.5G, 1000 W m −2 , 25 °C) [10] within only 10 years of development. Further they reach the highest power output densities under artificial indoor illumination (i.e., 20.2 µW cm −2 at 200 lx [11] ) which make them not only a bright candidate for energy harvesting outdoors but also for indoor IoT devices, sensors, and small consumer electronics [12] even for flexible substrates under artificial lighting. [13,14] The success of large area electronics in general lies in the advantageous properties of the materials used and in the fabrication processes (e.g., evaporation, sputtering or solution processing via printing techniques). These are also often compatible with flexible substrates. [15,16] Nevertheless, lifetimes of many of the constituent materials suffer when coming in contact with ambient moisture and oxygen [17][18][19] which can induce chemical degradation to the semiconducting, transport, and electrode layers. [20][21][22] To avoid moisture and oxygen ingress and further degradation, devices must be encapsulated with permeation barriers ensuring a water vapor transmission rate (WVTR) range of 10 −3 to 10 −6 g m −2 d −1 [23][24][25][26][27][28] and an oxygen transmission rate (OTR) between 10 −2 and 10 −5 cm 3 m −2 d −1 . [29][30][31][32] Encapsulation Effective transparent barrier/encapsulation systems represent a key enabling technology for large-area electronics. Securing stability to the environment is vital. Here, the effects of architectures, application processes, and water vapor transmission rates (WVTR) of transparent flexible ultra-high permeation barrier films (UHPBF) applied to substrates with adhesive resins are unraveled for attaining long lifetime, and compared with polyethylene terephthalate and glass barriers. How strongly performance of barrier/adhesive systems depends on barrier orientation, adhesion, manipulation, defects, and storage procedures is quantified via calcium tests. Furthermore, it is found that introducing an additional adhesion-promoting layer on the standard UHPBF stack reduces WVTRs by a factor of 5 compared to barriers without it. Finally, barriers are used fo...