2014
DOI: 10.7567/jjap.53.103001
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Process-induced damage and its recovery for a CoFeB–MgO magnetic tunnel junction with perpendicular magnetic easy axis

Abstract: We investigate the effect of process-induced damage (PID) caused by reactive ion etching using methanol (Me-OH) gas on the magnetic properties of the CoFeB free layer in a magnetic tunnel junction with a perpendicular easy axis (p-MTJ), and on the tunnel magnetoresistance (TMR) ratio of CoFeB-MgO p-MTJs. The dot pattern of the MTJ stack with size varied from 65 to 430 nm etched by the Me-OH plasma showed a smaller coercivity (H c ) than that fabricated by Ar ion milling. The increase in H c was observed in the… Show more

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Cited by 21 publications
(12 citation statements)
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“…This is likely due to patterning effects such as disorder of the local crystal structure or stoichiometry at the edges. Such effects become more pronounced as the critical dimension is reduced and the edge region makes up a larger fraction of the total volume 30,31 . Fig.…”
Section: B Size Dependence Of Recording Layer Coercivitymentioning
confidence: 99%
“…This is likely due to patterning effects such as disorder of the local crystal structure or stoichiometry at the edges. Such effects become more pronounced as the critical dimension is reduced and the edge region makes up a larger fraction of the total volume 30,31 . Fig.…”
Section: B Size Dependence Of Recording Layer Coercivitymentioning
confidence: 99%
“…88,89) Additional methods include methanol plasma etching, which requires further improvement in maintaining the etching selectivity and pattern transfer fidelity for high aspect ratio features. [88][89][90][91] ALEt can be partly considered as the reverse of ALD, and through the utilization of chemistries inspired by ALD precursors, can be controlled by exploiting the self-limiting nature of one of the surface reactions. Table II summarizes the general characteristics of ALD and ALEt, including the advantages of using thermal and plasma-enhanced ALD= ALEt, namely, the ability to achieve anisotropy using charged species as well as precise composition control and selectivity.…”
Section: Atomic Layer Processing Of Multiferroic Materialsmentioning
confidence: 99%
“…Practically, MTJ device property degradation (e.g., coercivity and TMR ratio decrease) induced by either method is the major issue to be overcome. Kinoshita et al [38] investigated this damage and proposed post-etching treatment using reductive He/H2 plasma, specifically for the CoFeB/MgO structure based MTJ with interfacial PMA. In this study, Methanol gas, which exhibits high etching selectivity against Ta hard mask, was used to conduct ICP processing.…”
Section: Device Etchingmentioning
confidence: 99%