Conductive composite nanofibers are promising materials, especially wearable strain sensors, due to their lightweight, breathability, flexibility, and skin affinity. Here, we propose a dual‐conductive network by the sequential decoration of amin‐modified boron nitride nanosheets (BN), copper nanoparticles (Cu), and polyaniline (PANI) into the elastic thermoplastic polyacrylonitrile (PAN) nanofiber. The Cu nanoparticles/BN‐enwrapped PANI nanocomposite was synthesized using successive environmentally friendly reduction and chemical oxidation polymerization. First, Cu (II) ions were immobilized on modified BN and reduced with L‐ascorbic acid (BN@Cu), followed by a chemical oxidation polymerization of aniline using ammonium persulfate as an initiator (BN@Cu/PANI). The XRD (X‐ray diffraction), FTIR (Fourier Transform Infrared Spectroscopy), SEM (Scanning Electron Microscopy), and TEM/EDXS (Transmission Electron Microscopy/Energy Dispersive X‐ray Spectroscopy) analysis confirmed the coexistence of the BN@Cu/PANI phase and composition. The DC electrical conductivity of BN@Cu/PANI nanocomposite (0.567 S/cm) was quietly higher than PANI (0.167 S/cm) and BN@Cu (0.077 S/cm). The thermal conductivity of BN@Cu and BN@Cu/PANI was 0.626 and 0.444 W/mK, respectively. The BN@Cu/PANI loaded‐PAN composite nanofibers were successfully produced by electrospinning. SEM studies confirmed that the composite nanofibers have uniform fiber structure and suitable BN@Cu/PANI dispersion/distribution within the PAN. BN@Cu/PANI‐reinforced PAN nanofibers showed a 2‐fold decrease in the specific heat capacity and a 50‐fold increase in electrical conductivity of the nanofibers at 10 wt%BN@Cu/PANI loading. This work offers dual‐conductive polymer‐based composites, which can be used in thermal management applications in microelectronics devices.Highlights
The dual‐conductive nanocomposite, BN@Cu/PANI, was prepared a simple, low‐cost method.
BN@Cu/PANI, core/shell nanocomposite, was easily produced this way for the first time.
BN@Cu nanoparticles increased the polymerization rate of PANI.
The thermal and electrical conductivity of BN@Cu/PANI was 0.444 W/mK and 0.567 S/cm.
Electrical conductivity of BN@Cu/PANI‐PAN increased 50‐fold increase at 10 wt%BN@Cu/PANI.