Processing of low-fired glass-free Li2MgTi3O8 microwave dielectric ceramics

The latest process and challenges of microwave dielectric ceramics based on pseudo phase diagrams

“…Lu et al [254] pointed out that the sintering rate increasing from 3 to 7 /min would deteriorate the quality f ℃ actor of Li 2 ZnTi 3 O 8 ceramics. If ball milling is applied for the raw materials at first for 4 h, then the sintering temperature of Li 2 ZnTi 3 O 8 ceramics could reduce from 1075 to 925 , and those ceramics were chemically ℃ compatible with Ag [255]. Sintering the ceramics in a box type electric furnace and in a microwave furnace would obtain Li 2 ZnTi 3 O 8 ceramics with the grain size of 38 and 7 µm, respectively [256].…”

High Thermal Conductivity Ceramics and Their Composites for Thermal Management of Integrated Electronic Packaging

“…Due to their complexity, several problems occurred during the preparation of LTCC circuits and devices in the integrated electronic module. To overcome this complexity in chemical interaction and inhomogeneous dielectric properties and difficulties in slurry dispersion, LTCC systems with simple phase components were developed [54][55][56][57][58][59][60] ( Table 7).…”

“…Finding a low temperature synthesis and low temperature melting crystalline phase ceramic compound is a crucial point to develop glass-free LTCCs. Glass-free LTCC compositions applicable in the industry with proven mechanical properties and reliabilities are hardly found, even though several primary research results showing excellent dielectric properties were reported [54][55][56][57][58][59][60]. The substantial problems exposed in the previous glass-free LTCC systems are weak mechanical strength, reactive with matching electrode materials during heat treatment, and vulnerable in moisture environment.…”

Enhanced flexural strength and microwave dielectric properties of Li2MgTi3O8-based low temperature co-fired ceramics

“…4 However, their high sintering temperature and poor flexural strength (99.534 MPa) make them impossible to be used in LTCC ceramic substrate devices. 5,6…”

“…4 However, their high sintering temperature and poor flexural strength (99.534 MPa) make them impossible to be used in LTCC ceramic substrate devices. 5,6 Most researchers have found that TiN has a high melting point (approximately 3200 K), excessive hardness (approximately 21 GPa) and good chemical stability, which can help improve the mechanical properties of ceramics. [7][8][9] Li et al 10 found that 20 vol% TiN can increase the flexural strength of hot-pressed Al 2 O 3 ceramics from 370 MPa to 725 MPa and the fracture toughness from 3.40 MPa m 1/2 to 5.27 MPa m 1/2 .…”