2009
DOI: 10.1016/j.microrel.2009.02.023
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Processing procedures for the realization of fine structured channel arrays and bridging elements by LTCC-Technology

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Cited by 41 publications
(35 citation statements)
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“…caused by the laser cutting process. One of the drawbacks of laser patterning is that the laser cut vias and channels normally have a tapered shape [12,21].…”
Section: --10--21 7/17mentioning
confidence: 99%
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“…caused by the laser cutting process. One of the drawbacks of laser patterning is that the laser cut vias and channels normally have a tapered shape [12,21].…”
Section: --10--21 7/17mentioning
confidence: 99%
“…be reduced by supporting them with special sacrificial volume materials (SVM). A considerable number of papers reporting of successful application of different types of substances as an SVM: wax [6], carbon/graphite-based layers [3,[7][8][9][10][11], polymers [12,13] and mineral materials [14][15][16]. Application of various sacrificial volume materials for LTCC 3-D microstructuration has been the object of several reviews [11,17,18].…”
Section: Introductionmentioning
confidence: 99%
“…13 It consequently promotes the integration ability of electronic components, such as sensors, actuators and electrical packaging, in LTCC devices for realizing accurate process control and real-time automation. 14,15 Another advantage of LTCC for making microreactors is that their green tapes appear flexible and can be easily machined to create cavities via milling, 16 embossing, 17 laser cutting, 18 and use of sacrificial materials. 19 Through stacking and laminating these green tapes with cavities in 3D, these stacks can incorporate various embedded or open fluidic structures in the sub-mm scale, such as packed beds, 20 microchannels, 9 heat exchangers 21 and mixers, for desired chemical processes.…”
Section: Introductionmentioning
confidence: 99%
“…Aside from adhesives, chemical solvents are also used for temporary gluing of LTCC green tapes at low pressure and room temperature. 18,25 These solvents are usually some of the organic compositions of LTCC green tapes or thick film materials. Although these methods are proven to achieve sustainable LTCC cavities with very minimal deformation, their process reliability can be a potential issue in integrating thick film materials or electrical vias.…”
Section: Introductionmentioning
confidence: 99%
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