2011
DOI: 10.1109/tasc.2010.2085072
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Production and Quality Assurance of Main Busbar Interconnection Splices During the LHC 2008–2009 Shutdown

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Cited by 12 publications
(9 citation statements)
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“…The two main reasons for this was a large interconnection resistance > 5 μΩ [11] and geometrical imperfections of the interconnections. This would have prevented the shunt application due to required copper surface preparation by unacceptable reduction of the busbar copper thickness [12].…”
Section: A Increased Amount Of Main Splices To Be Repairedmentioning
confidence: 99%
“…The two main reasons for this was a large interconnection resistance > 5 μΩ [11] and geometrical imperfections of the interconnections. This would have prevented the shunt application due to required copper surface preparation by unacceptable reduction of the busbar copper thickness [12].…”
Section: A Increased Amount Of Main Splices To Be Repairedmentioning
confidence: 99%
“…In addition the specified 20,000 current cycles from 2 kA to 14 kA and one thermal cycle were performed. The quality control [4]- [5] after the test campaign has shown that this extensive test has not shown any measurable increase of the resistance of the shunted interconnections resistance. In addition no degradation or sign of fatigue was observed on the insulation hardware.…”
Section: The Final Validation Of the Designmentioning
confidence: 99%
“…Initially, splice quality is insured by peeling apart solder joint and inspecting for voids. Room temperature resistance measurement can also be used as was performed during the LHC 2008-2009 shutdown [7]. …”
Section: Bus Splice Designmentioning
confidence: 99%