Production of Oxidation-Resistant Cu-Based Nanoparticles by Wire Explosion

Kawamura, Go; Alvarez, Samuel; Stewart, Ian; Catenacci, Matthew J.; Chen, Zuofeng; Ha, Yoon‐Cheol

doi:10.1038/srep18333

Cited by 55 publications

(31 citation statements)

References 49 publications

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“…Silver is ≈100 times more expensive than copper, [151] and silver is only 6% more electrically conductive than copper. Silver is ≈100 times more expensive than copper, [151] and silver is only 6% more electrically conductive than copper.…”

Section: Cu-ag Core-shell Bimetallic Nanoparticle Inksmentioning

confidence: 99%

“…On the one hand, silver nanoparticle inks are too costly to be used for large‐scale fabrications of printed electronics despite their superior electrical and material properties. Silver is ≈100 times more expensive than copper, and silver is only 6% more electrically conductive than copper. On the other hand, copper has excellent electrical properties, but copper nanoparticles are highly susceptible to oxidation in ambient environment at elevated temperatures.…”

Section: Core–shell Bimetallic Nanoparticle Inksmentioning

confidence: 99%

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Metallic Nanoparticle Inks for 3D Printing of Electronics

Tan

Chua

et al. 2019

Adv Elect Materials

209

100

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Metallic nanoparticle inks are readily obtainable from the commercial market and are commonly used for fabricating conductive tracks and patterns due to their relatively higher electrical conductivity as compared to other types of inks. These metallic nanoparticle inks are made up of electrically conductive metallic nanoparticles suspended in liquid mediums, with particle size ranging from 1 to 100 nm. However, there are also diverse types of metallic nanoparticle inks in the market (for instance, silver nanoparticle inks, gold nanoparticle inks, and copper nanoparticle inks). Metallic nanoparticle inks of different material compositions can directly influence the final electrical, material, and mechanical properties of the printed patterns. This paper presents an overview of the different types of metallic nanoparticle inks used for the 3D printing of electronics. The strengths and weaknesses of each type of ink are critically reviewed. The challenges and potentials of metallic nanoparticle inks in 3D printed electronics are also discussed. Metallic Nanoparticle InksMetallic nanoparticle inks are suspensions of metallic nanoparticles in liquid mediums (see Figure 2a), in which individual metallic nanoparticle is encapsulated in a layer of insulating organic additives and stabilizing agents (see Figure 2b). The encapsulating organic additives and stabilizing agents help prevent the metallic nanoparticles from agglomeration, but at the same time, also impede the flow of electrons from particles to particles. Therefore, sintering processes are required to remove The three-dimensional (3D) printed electronics additive manufacturing industry sector has grown substantially in the past few years, and there is increasing demand for different types of metallic nanoparticle inks in electronics printing for various applications. Metallic nanoparticle inks are commonly used for fabricating conductive tracks and patterns due to their relatively high electrical conductivity as compared to other types of inks, and they can be further categorized into single-element metallic nanoparticle inks, alloy metallic nanoparticle inks, metallic oxide nanoparticle inks, and core-shell bimetallic nanoparticle (BNP) inks. It is critical to gain a deep understanding of the metallic nanoparticle inks used in 3D printed electronics as the material properties of these inks can directly affect the final electrical and mechanical properties of the printed patterns. This review presents an overview of the available metallic nanoparticle inks used for 3D printing of electronics, and critically reviews the strengths and weaknesses of each type of ink. Finally, the challenges of metallic nanoparticle inks in 3D printed electronics are also discussed along with the future outlook for 3D printed electronics.

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Section: Cu-ag Core-shell Bimetallic Nanoparticle Inksmentioning

confidence: 99%

Section: Core–shell Bimetallic Nanoparticle Inksmentioning

confidence: 99%

Metallic Nanoparticle Inks for 3D Printing of Electronics

Tan

Chua

et al. 2019

Adv Elect Materials

209

100

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“…Cu-Ni: An alloying of Cu with Ni or a coating of Ni on Cu can be utilized to improve the oxidation resistance of Cu by forming a Ni-containing thin oxide layer. Kawamura et al utilized a wire explosion process ( Figure 9 a) to produce Cu alloy nanoparticles in an aqueous solution of 200 mM AA, including 99Cu-1Sn, 95Cu-5Ag, 95Cu-5Ni, and 70Cu-30Ni [ 91 ]. The conductive films of as-prepared Cu nanoparticles exhibited electrical resistivities of 172 μΩ·cm by sintering at 200 °C in H 2 .…”

Section: Surface Designs By Surface Protective Layers Against the mentioning

confidence: 99%

“…( b ) Time-dependent conductivity attenuation during exposure to 85 °C and 85% relative humidity (RH). Reprinted with permission from reference [ 91 ], Copyright Springer Nature, 2015. ( c ) Schematic illustration of the fabrication of large-area Cu@Ni core-shell NP-based electrodes on a polymeric substrate and high-resolution transmission electron microscopy (HRTEM) image and elemental distribution maps of Cu@Ni core-shell NPs.…”

Section: Figurementioning

confidence: 99%

Surface and Interface Designs in Copper-Based Conductive Inks for Printed/Flexible Electronics

Tomotoshi

Kawasaki

2020

Nanomaterials

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Silver (Ag), gold (Au), and copper (Cu) have been utilized as metals for fabricating metal-based inks/pastes for printed/flexible electronics. Among them, Cu is the most promising candidate for metal-based inks/pastes. Cu has high intrinsic electrical/thermal conductivity, which is more cost-effective and abundant, as compared to Ag. Moreover, the migration tendency of Cu is less than that of Ag. Thus, recently, Cu-based inks/pastes have gained increasing attention as conductive inks/pastes for printed/flexible electronics. However, the disadvantages of Cu-based inks/pastes are their instability against oxidation under an ambient condition and tendency to form insulating layers of Cu oxide, such as cuprous oxide (Cu2O) and cupric oxide (CuO). The formation of the Cu oxidation causes a low conductivity in sintered Cu films and interferes with the sintering of Cu particles. In this review, we summarize the surface and interface designs for Cu-based conductive inks/pastes, in which the strategies for the oxidation resistance of Cu and low-temperature sintering are applied to produce highly conductive Cu patterns/electrodes on flexible substrates. First, we classify the Cu-based inks/pastes and briefly describe the surface oxidation behaviors of Cu. Next, we describe various surface control approaches for Cu-based inks/pastes to achieve both the oxidation resistance and low-temperature sintering to produce highly conductive Cu patterns/electrodes on flexible substrates. These surface control approaches include surface designs by polymers, small ligands, core-shell structures, and surface activation. Recently developed Cu-based mixed inks/pastes are also described, and the synergy effect in the mixed inks/pastes offers improved performances compared with the single use of each component. Finally, we offer our perspectives on Cu-based inks/pastes for future efforts.

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“…The invented technique involves copper-containing particles being encapsulated by additional layers of metal and alloys to restrict oxidation and diffusion of copper during the firing. For improving the oxidation resistance of copper, alloying copper with other metals (Ti, Mg, Al, Pd, Ag, Ni, Cr, and Zr) has been researched [37][38][39][40]. The Cu-Ag alloy is estimated as the best materials for improving oxidation resistance with only a slight reduction in electrical conductivity [41].…”

Section: Copper Paste For High-temperature Annealing (Firing Type)mentioning

confidence: 99%

Conductive Copper Paste for Crystalline Silicon Solar Cells

Lee¹,

Lee²

2019

Recent Developments in Photovoltaic Materials and Devices

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In photovoltaic industries, the main technique of metallization is screen printing with silver pastes due to its simple and quick process. However, the expensive price of silver paste is one of the barriers to the production of low-cost solar cells. Therefore, the most focused target in photovoltaic research is the decreasing consumption of silver paste or substitute silver for other materials. As a proper candidate, copper has been researched by many institutes and companies since it has a similar conductivity with silver even though the price is inexpensive. To apply copper as a contact for solar cells, the plating technique has been actively researched. However, copper paste, which was mainly developed for integrated circuit applications, has been recently researched. Mostly, copper paste was developed for the low-temperature annealing process since copper tends to oxidize easily. On the other hand, firing type copper paste was also developed by coating copper particles with a barrier layer. This chapter discusses recent development of copper paste for the application of solar cells and its appropriate annealing conditions for better electrical properties. Also, the light I-V characteristics of copper paste on the solar cells in other research papers are summarized as well.

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Production of Oxidation-Resistant Cu-Based Nanoparticles by Wire Explosion

Cited by 55 publications

References 49 publications

Metallic Nanoparticle Inks for 3D Printing of Electronics

Metallic Nanoparticle Inks for 3D Printing of Electronics

Surface and Interface Designs in Copper-Based Conductive Inks for Printed/Flexible Electronics

Conductive Copper Paste for Crystalline Silicon Solar Cells

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