Prognostic and Remaining Life Prediction of Electronic Device under Vibration Condition Based on CPSD of MPI

Chen, Ying; Tang, Ning; Yuan, Zenghui

doi:10.1155/2016/2650569

Cited by 1 publication

(1 citation statement)

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“…The last one is monitoring environmental and usage profiles for damage modeling. Some researchers have used environment loadings such as temperature, humidity, and vibration to assess the reliability of products [7][8][9][10]. However, there could be a great uncertainty to assess reliability by monitoring environmental loadings and usage profiles, and its result may be very inaccurate due to the difference between the monitoring environmental loadings and the actual environmental loadings suffered by devices.…”

Section: Introductionmentioning

confidence: 99%

A Health Indicator for Interconnect structure of QFP Package Under Vibration and Steady Temperature

Jing

Huang

et al. 2020

IEEE Access

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Interconnect structure, as the weak point of reliability, is often the critical part in electronic devices during their service. In order to monitor the health state and degradation of interconnect structure, the charging time is used as the health indicator for interconnect structure of QFP package in this paper. Firstly, a monitoring circuit, based on the proposed electrical model of interconnect structure, is designed to measure the charging time in real time. Secondly, the equivalent circuit of the monitoring circuit is derived and the effect of the parameters of the monitoring circuit on the charging time is analyzed. Then, experiments under vibration and steady temperature are conducted to analyze the failure of interconnect structure and derive the damage model. Finally, the effect of charging time as the health indicator to monitor the damage of interconnection structures is analyzed and the uncertainty is discussed. Results show that the charging time is directly related to the interconnect damage and can well characterize the interconnect failure, which can be used as a health indicator to assess the damage and predict the failure of interconnect structure.

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Section: Introductionmentioning

confidence: 99%