Program FFlexCom — High frequency flexible bendable electronics for wireless communication systems

Meister, Tilo; Ellinger, Frank; Bartha, Johann W.; Berroth, Manfred; Burghartz, Joachim N.; Claus, Martin; Frey, L.; Gagliardi, Alessio; Grundmann, Marius; Hesselbarth, Jan; Klauk, Hagen; Leo, Karl; Lugli, Paolo; Mannsfeld, Stefan C. B.; Manoli, Yiannos; Negra, Renato; Pfeiffer, Ullrich R.; Riedl, Thomas; Scheinert, S.; Scherf, Ullrich; Thiede, A.; Tröster, Gerhard; Vossiek, Martin; Weigel, Robert; Wenger, Christian; Alavi, Golzar; Becherer, Markus; Chavarin, Carlos Alvarado; Darwish, Mohammed; Ellinger, Martin; Fan, Chao; Fritsch, Martin; Grotjahn, F.; Gunia, Marco; Haase, Katherina; Hillger, Philipp; Ishida, Koichi; Jank, Michael P. M.; Knobelspies, Stefan; Kuhl, Matthias; Łupina, Grzegorz; Naghadeh, Shabnam Mohammadi; Münzenrieder, Niko; Özbek, Sefa; Rasteh, Mahsa; Salvatore, Giovanni A.; Schrüfer, Daniel; Strobel, C.; Theisen, Manuel; Tückmantel, Christian; Wenckstern, Holger von; Wang, Zhenxing; Zhang, Zhipeng

doi:10.1109/comcas.2017.8244733

Cited by 16 publications

(4 citation statements)

References 12 publications

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“…In addition to a large amount of available bandwidth, the size of an antenna and other passives used in the transceiver scale inversely with frequency [5]- [11]. Flexible ASICs can be realized either by inherently flexible semiconductors consisting of non-silicon organic and inorganic semiconductors [12]- [15] or by thinning fully processed conventional semiconductors. The latter approach has the advantage of high carrier mobilities in established highspeed silicon technologies needed for operation at mmWave frequencies [16].…”

Section: (B)mentioning

confidence: 99%

Characterization of Embedded and Thinned RF Chips

Yin,

Morath,

Hoyer

et al. 2024

IMAPSource Proceedings

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This work studies the effect of thinning down chips with transmission line structures for flexible embedding technology. Test chips with 90 Ω grounded coplanar waveguide (GCPW) transmission lines have been designed and manufactured to characterize the high-frequency performance before and after embedding in sheet molding compound (SMC), and thinning down from 300 μm to 20 μm. Molding first technology enables single-die or multiple-die thinning with the embedding material while being held in the exact position, where the subsequent fanout copper (Cu) redistribution layer (RDL) structuring realizes the direct contacts to the embedded chip, followed by semiadditive manufacturing of traces. The embedded and thinned chips are characterized by S-parameter measurements in the frequency range from 20 MHz to 65 GHz using a vector network analyzer (VNA). The results show the feasibility of the examined embedding and thinning processes which are suitable for millimeter wave (mmWave) components as shown by the example of a G-CPW transmission line without degrading its RF performance in terms of characteristic impedance and attenuation.

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Section: (B)mentioning

confidence: 99%

Characterization of Embedded and Thinned RF Chips

Yin,

Morath,

Hoyer

et al. 2024

IMAPSource Proceedings

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“…For many practical applications, amplifiers and oscillators need to achieve high operating speed, high-gain, and/or low power consumption. Especially in the case of wireless applications, all of the above mentioned parameters are required at the same time [125]. This is why, in this section we will explore commonly used methods to achieve flexible metal oxide TFT based amplifiers and oscillators with high operating frequency, high gain and low power consumption.…”

Section: Flexible Metal Oxide Analog Circuitsmentioning

confidence: 99%

Review of recent trends in flexible metal oxide thin-film transistors for analog applications

Cantarella

Costa

Meister

et al. 2020

Flex. Print. Electron.

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Thanks to the extraordinary advances flexible electronics have experienced over the last decades, applications such as conformable active-matrix displays, ubiquitously integrated disposable flexible sensor nodes, wearable or textile-integrated systems, as well as imperceptible and transient implants are now reachable. To enable these applications, specialized analog circuits able to transmit and receive data, condition sensors' parameters, drive actuators or control powering devices are required. High-performance sensor conditioning, driving and transceiver circuits on a wide range of flexible substrates are therefore extremely important to develop. However, the currently available materials and processes compatible with mechanically flexible substrates impose massive limitations in terms of large-area uniformity, device dimensions' shrinkability and circuit design, challenging the realization of flexible analog systems. Among state-of-the-art technologies employing low-temperature fabrication processes, thin-film transistors (TFTs) based on metal oxide semiconductors represent the potentially best compromise in terms of prize, performance, technology maturity and capacity to realize complex systems. This is why metal oxide TFTs are nowadays widely used for flexible, light-weight, transparent, stretchable and bio-degradable analog circuits and systems. Here, we review the current trends of flexible metal oxide TFTs for analog applications. First, an introduction is given, where current challenges and requirements related to the realization of flexible analog circuits and systems are analysed. Additionally, TFT performance parameters and configurations are briefly revised. Then, the recent advances in the field of flexible metal oxide TFTs for analog applications are summarized. In particular, all reported approaches to reduce the channel length and improve the AC performance are shown. Next, the current state of flexible metal oxide TFT-based analog circuits is shown, discussing n-type only and complementary circuit configurations. The last topic of the review covers systems based on flexible metal oxide analog circuits. Finally, a conclusion is drawn and an outlook over the field is provided.

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“…Radio-frequency identification (RFID) applications are countless. However, the combination of specifications such as long-range, high communication data-rates, lower power consumption, low cost, and flexibility of the device is restricted [1,2]. In this matter, the flexible and adaptive energy-efficient high-speed wireless hub is a research topic with the criterion of a “long-range, environment agnostic wireless reading range” means that the device must be small, thin, and mechanically flexible in order to conform to arbitrary surfaces and to accommodate to mechanical cycling.…”

Section: Introductionmentioning

confidence: 99%

Toward a flexible and adaptive wireless hub by embedding power amplifier thinned silicon chip and antenna in a polymer foil

Alavi

Özbek

Rasteh

et al. 2019

Int. J. Microw. Wireless Technol.

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A flexible and adaptive energy-efficient high-speed wireless hub is developed in polymer foil as a Hybrid System-in-Foil (HySiF) using Chip-Film Patch (CFP) technology. In this matter, the SiGe BiCMOS silicon chips (2.39 × 1.65 mm2) are thinned down to 45 μm and are embedded face-up inside a two-polymer CFP carrier. The active pads of the embedded silicon chips inside foil are extended to the surface of the foil to interconnect to the antenna on the foil. The integrated hybrid system has a signal transmission at 5–6 GHz frequency band. The overall thickness of the system is below 100 μm and its bendability is down to 4 mm radius of curvature. The designed and fabricated PA silicon chips operate at 50 mA with a 1.5 V supply voltage. Therefore, in addition to the high lateral thermal resistance of the thinned chip, self-heating loop inside polymer due to the low thermal conductivity of the embedding polymer raises the system temperature. Consequently, the thermal behavior and RF performance of the PA chip under different conditions are investigated. Moreover, the antenna with the required carrier frequency is simulated, fabricated, and measured on top of the polymer foil as a stand-alone system in the flexible CFP.

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Program FFlexCom — High frequency flexible bendable electronics for wireless communication systems

Cited by 16 publications

References 12 publications

Characterization of Embedded and Thinned RF Chips

Characterization of Embedded and Thinned RF Chips

Review of recent trends in flexible metal oxide thin-film transistors for analog applications

Toward a flexible and adaptive wireless hub by embedding power amplifier thinned silicon chip and antenna in a polymer foil

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