Optical Trapping and Optical Micromanipulation XIV 2017
DOI: 10.1117/12.2274448
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Programmable diffractive optic for multi-beam processing: applications and limitations

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Cited by 5 publications
(3 citation statements)
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“…To increase productivity, today higher repetition rates and fluences are employed, resulting in heat accumulation and plasma shielding effects [12][13][14][15][16] . In general, heat accumulation in the machining process leads to a decrease in component quality, but Gruner et al 7 also show an increasing ablation rate in a drilling process in 100 µm thick single polished silicon, caused by the use of a higher repetition rate of 48.78 MHz at a low fluence of 0.53 J/cm².…”
Section: Introductionmentioning
confidence: 99%
“…To increase productivity, today higher repetition rates and fluences are employed, resulting in heat accumulation and plasma shielding effects [12][13][14][15][16] . In general, heat accumulation in the machining process leads to a decrease in component quality, but Gruner et al 7 also show an increasing ablation rate in a drilling process in 100 µm thick single polished silicon, caused by the use of a higher repetition rate of 48.78 MHz at a low fluence of 0.53 J/cm².…”
Section: Introductionmentioning
confidence: 99%
“…Aiming to increase productivity, higher repetition rates and fluences are often used, which result in heat accumulation and plasma shielding effects [12][13][14][15][16]. While heat accumulation in components generally results in negative effects in the machining process, Gruner et al [7] showed an increasing ablation rate using a high repetition rate of 48.78 MHz and a low fluence of 0.53 J/cm 2 in a drilling process in 100 µm thick single-side polished silicon.…”
Section: Introductionmentioning
confidence: 99%
“…In particular, the size of the heat-affected zone, which results from a combination of laser parameters, the material properties, and the ablation process, is an important industry consideration for cutting and drilling applications using an USP laser. Aiming to increase the productivity of USP-processes, higher repetition rates and fluences are often used, which results in heat buildup and plasma shielding effects [ 12 , 13 , 14 , 15 , 16 ]. While heat accumulation generally results in negative effects, Gruner et al [ 6 ] showed an increasing ablation rate for a high repetition rate of 48.78 MHz and a low fluence of 0.52 J/(cm 2 ) during a drilling process without impairing the quality.…”
Section: Introductionmentioning
confidence: 99%