“…This has led to innovative approaches such as SCALPEL which utilises the angular scattering properties of electrons, rather than absorption in the mask, to create intensity variations across a resist. 2,8,9,11 In addition there has been a development of maskless approaches, including the use of multiple beams, 14,15 low energy electron microscopy, 10 and reflective electron beam lithography (REBL) wherein the electron beam is reflected by an array of electrostatic mirrors. 12,13 In this letter we describe a complementary approach to REBL and electron projection lithography which is based on the formation of intense electron caustics which can be subsequently projected onto a resist by suitable electron optics.…”