Properties of an electroless copper process as a function of nickel and cyanide ion concentrations

Brown, Delilah A.; MacDonald, Alex R.; McCarron, Eamon A.; Zarwell, Sebastian; Bernhard, T.; Brüning, Ralf

doi:10.1007/s10800-021-01535-3

Cited by 5 publications

(2 citation statements)

References 18 publications

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“…Ultrasound can etch the surface of the material and make it coarse and dispersive. With the successful application of ultrasound in the chemical field and other technologies for surface treatment as a particular phase of energy input, it has attracted more and more attention from researchers worldwide [21][22][23] .…”

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confidence: 99%

Effects of ultrasonic-assisted nickel pretreatment method on electroless copper plating over graphene

Peng

Tan

Venkataraman

et al. 2022

Sci Rep

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In this paper, copper deposited graphene was fabricated through electroless plating. A novel and facile pretreatment method is introduced based on ultrasonic treatment with nickel nano-particles as the catalytic core. This method abandons the sensitization and activation process in the traditional pretreatment that reduces the time and economic cost dramatically. The static contact angle was determined by an Olympus BX51M optical microscope. The surface morphology and plating composition were characterized via scanning electron microscope (SEM) and energy dispersive spectroscopy (EDS), the infrared radiation (IR) transmittance spectra of the copper plated graphene were measured by Fourier transform infrared spectroscopy (FTIR), the layer structure was measured by Raman spectrum, the phase identification was identified by X-ray diffraction (XRD), the thermogravimetric analysis (TGA) (Q5000 TA instruments, USA) was carried out to detect the thermal characteristics. The electrical resistivity of copper-plated graphene was performed in an especially designed apparatus. The results show that the surface of graphene is coarsened, and the size is reduced after ultrasonic treatment, which can facilitate the nucleation and fine particle distribution of metal. The electroless plated efficiency of copper of the nickel pretreatment copper-plated graphene is 64.27 wt%, higher than that of generic copper-plated graphene at 58.62 wt%. The resistivity decreases rapidly from 1.69 × 10–2 Ω cm of the original Gr to 0.79 × 10–2 Ω cm of Cu/Ni@Gr due to the large number of fine copper particles scattered around the graphene.

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confidence: 99%

Effects of ultrasonic-assisted nickel pretreatment method on electroless copper plating over graphene

Peng

Tan

Venkataraman

et al. 2022

Sci Rep

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“…Kim et al [17] simulated the electrochemical kinetics with the flow of ions in the electrolyte by fully coupling it with a simplified three-dimensional transport model of a copper electrolyzer. In addition, since the rising oxygen bubbles and electrolyte temperature during electrolysis can adversely affect cathodic mass transfer [18], a large number of researchers have paid much attention to the simulation of the flow of rising bubbles within copper electrolytes [19,20,21,22], Le AS [23] and Li MZ [24] simulated temperature variations in a copper electrolyte's electrolyte inlet, outlet, and inter-electrode using CFD software. They proposed effective measures to improve electrolyte flow and minimize mass transfer effects caused by temperature variations.…”

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confidence: 99%

Numerical Simulation of Cathode Nodule Local Effeccts

Wang,

Li,

Tie

et al. 2024

Preprint

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As one of the main factors decreasing current efficiency and product quality, the growth of nodules deserves attention in the copper electrorefining process. 3D FEM models combining tertiary current distribution and fluid flow were established in this study to investigate the details of the growth of columnar nodules, including the electrolyte flow around the nodule and its effects. Compared with an inert nodule, a significant impact of the electrochemical reaction of an active nodule has been observed on the fluid flow, which may be one of the reasons for the formation of small nodule clusters on the cathode. Furthermore, the local current density isn't even on the nodule surface under the comprehensive influence of local electrolyte flow, local overvoltage, and the angle with the anode surface. Thus, the head of an active nodule grows faster than the root, and the upper parts grow faster than the lower parts, leading to asymmetric growth of the nodules.

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Compound additives and stress study of EDTA-2Na chemical copper plating system in printed circuit boards

Li,

Zhao,

Cheng

et al. 2024

J Mater Sci: Mater Electron

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Properties of an electroless copper process as a function of nickel and cyanide ion concentrations

Cited by 5 publications

References 18 publications

Effects of ultrasonic-assisted nickel pretreatment method on electroless copper plating over graphene

Effects of ultrasonic-assisted nickel pretreatment method on electroless copper plating over graphene

Numerical Simulation of Cathode Nodule Local Effeccts

Compound additives and stress study of EDTA-2Na chemical copper plating system in printed circuit boards

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