2010
DOI: 10.1002/crat.200900624
|View full text |Cite
|
Sign up to set email alerts
|

Properties of non‐stoichiometric nitrogen doped LPCVD silicon thin films

Abstract: The influence of nitrogen on the internal structure and so on the electrical properties of silicon thin films obtained by low-pressure chemical vapor deposition (LPCVD) was studied using several investigation methods. We found by using Raman spectroscopy and SEM observations that a strong relationship exists between the structural order of the silicon matrix and the nitrogen ratio in film before and after thermal treatment. As a result of the high disorder caused by nitrogen on silicon network during the depos… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1

Citation Types

0
2
0

Year Published

2011
2011
2017
2017

Publication Types

Select...
6

Relationship

0
6

Authors

Journals

citations
Cited by 6 publications
(2 citation statements)
references
References 15 publications
0
2
0
Order By: Relevance
“…28-30 EDX analysis of Si x N y shows a nonfixed ratio of x to y, which indicates that the LPCVD silicon nitride herein is nonstoichiometric, i.e., SiN x . 31 For coated microcantilevers, the radius of curvature and surface roughness of microcantilevers as functions of Al film thickness are shown in Figs. 3(a) and 3(b), respectively.…”
Section: Resultsmentioning
confidence: 99%
“…28-30 EDX analysis of Si x N y shows a nonfixed ratio of x to y, which indicates that the LPCVD silicon nitride herein is nonstoichiometric, i.e., SiN x . 31 For coated microcantilevers, the radius of curvature and surface roughness of microcantilevers as functions of Al film thickness are shown in Figs. 3(a) and 3(b), respectively.…”
Section: Resultsmentioning
confidence: 99%
“…Indeed, the excess of silicon in films allows high silicon crystallites concentration after heat treatment while the nitrogen atoms increase the disorder in the silicon network during the film deposit phase [15] in one hand and suppress the crystallites growth during the thermal annealing process, in the other hand. We combine in our crystallization process a high temperature annealing (1100 °C) to activate the nucleation phenomena with a short annealing duration (1 min) in order to avoid an eventual enhancement in the silicon crystallites sizes.…”
Section: Introductionmentioning
confidence: 99%