Properties of Sn0.7Cu Solder Alloys Bearing Fe and Bi

Sabri, Mohd Faizul Mohd; Salleh, Mohd Faiz Mohd; Jaffery, Syed Hassan Abbas; Mahdavifard, Mohammad Hossein

doi:10.1007/978-3-030-93441-5_7

Cited by 1 publication

(1 citation statement)

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“…Although the contribution of nano additions to thermal properties is limited, its effect on mechanical properties, especially creep resistance is quite evident. The addition of metallic nanoparticles in particular Fe, Ni, Cu etc…, affects the chemistry of the solder and promote the formation of intermetallic phase [16][17][18][19][20][21][22][23][24]. Considering that thickened intermetallic layers reduce the mechanical properties, the mechanical property of the solder is also diminished, especially during the thermal cycle [16,19,20,22,24,25].…”

Section: Introductionmentioning

confidence: 99%

The Microstructural, Mechanical and Electrical Properties of Pb-Sn and Lead-Free SC0.7 Solders Containing Sub Micron Active Carbon Particles

Talaş,

Özkan,

Ayar

2024

Politeknik Dergisi

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Soldering is performed in order to easily assemble electronic components and also to provide electrical conductivity. The strengths, hardness, physical properties and electronic properties of the solders, i.e. reduced energy loss, hardness, melting point and longer service life, can be achieved when their usage is improvised by the help of necessary alloying or neutral additions. In this study, the effect of the addition of sub micron sized activated carbon on the mechanical, physical and electrical properties of industrially used solders, i.e. Pb-Sn and lead free SC0.7 solder was investigated.The thermal studies showed that the melting point of Pb-Sn was lowered against lead free solders with increasing amount of activated carbon. The tensile shear strength of both solders did not improve with increasing amount of activated carbon. In lead-free solders, the electrical resistance values decrease with respect to increasing active carbon ratio, however, the resistance of Pb-Sn solders increased. The addition of active particles have positively affected the microstructure of Pb-Sn solders, resulting in a finer grains, whereas, the addition of active carbon particles have no effect on the grain structures of lead free solder.

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