Properties of SnAgCu/SnAgCuCe soldered joints for electronic packaging

Zhang, Liang; Xue, Songbai; Gao, Lili; Su, Zhong Ming; Zeng, Guang; Chen, Yan; Yu, Sirong

doi:10.1007/s10854-009-9969-1

Cited by 16 publications

(5 citation statements)

References 23 publications

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“…Figure 5 shows the pull strength data of the QFP soldered joints and the tensile force of the SnAgCuCe soldered joints was found to be evidently stronger than that of SnAgCu soldered joints, which means that adding a trace amount of the RE cesium can significantly increase the tensile strength of the SnAgCu soldered joints. The improvement in mechanical properties achieved by adding small amounts of Ce can be explained by the microstructures and interfacial compounds of the soldered joints, as reported previously (Zhang, L. et al , 2009a‐d, 2010). Moreover, the thermal fatigue performances of the three lead‐free solder joints, SnAgCuCe, SnAgCu and SnAg, were determined to be superior to that of the eutectic SnPb alloy.…”

Section: Resultssupporting

confidence: 73%

Tensile strength of fine pitch QFP lead‐free soldered joints with diode laser soldering

Xue

Zhang

et al. 2011

Soldering &Amp; Surface Mount Technology

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PurposeThe purpose of this paper is to investigate the laser soldering of fine pitch quad flat package (QFP) devices using lead‐free solders and solder joint reliability during thermal cycling.Design/methodology/approachQFP devices were selected as the test vehicles and were soldered with four alloy types, Sn37Pb, Sn3.5Ag, Sn3.8Ag0.7Cu and Sn3.8Ag0.7Cu0.03Ce. The experimental samples were QFP‐256 devices with lead‐free solder paste on the printed circuit boards. The packages were dried for 24 h at 125°C prior to reflow soldering. Soldering experiments on the QFP devices were carried out with an infrared (IR) reflow soldering oven and a diode laser (DL) soldering system. Reflow soldering was performed at peak temperatures of 210°C (SnPb), 240°C (SnAgCu and SnAgCuCe) and 250°C (SnAg), as determined on the boards. Pull testing was adopted to evaluate the tensile strength of the four solders using an STR–1000 micro‐joint strength tester.FindingsThe tensile force of the QFP micro‐joints increased as laser intensity increased when it was less than an “optimal” value. The maximum tensile force of the QFP micro‐joints was gained when the laser intensity had increased to 2,165, 2,127, 2,165 and 2,064 W/cm2, depending on the alloy used. The thermal fatigue performance of three lead‐free solder joints, SnAgCuCe, SnAgCu and SnAg, was determined to be superior to that of the eutectic SnPb alloy. After soldering without thermal cycling tests, the fracture morphology of soldered joints exhibited characteristic toughness fracture with both of the soldering methods. After 700 thermal cycles, the fracture mechanism was also toughness fracture, nevertheless, the dimples became large. The fracture morphology of the soldered joints subjected to 1,500 thermal cycles indicated brittle intergranular fracture on the fracture surface and no intense plastic deformation appeared before fracture with IR soldering. For DL soldering, the pull fracture model of the SnAgCuCe was completely ductile in the soldered joint with 1,500 thermal cycles.Originality/valueThe paper usefully investigates the influence of laser intensity on the tensile strength of different soldered joints and the solder joint reliability during thermal cycling.

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Section: Resultssupporting

confidence: 73%

Tensile strength of fine pitch QFP lead‐free soldered joints with diode laser soldering

Xue

Zhang

et al. 2011

Soldering &Amp; Surface Mount Technology

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“…The first group are alloys based on the Sn-Ag-Cu system (SAC) with addition of different metals. [1][2][3][4][5][6] Sn-Zn alloys with additions such as Cu, Ag, In, Sb, and Bi [7][8][9][10][11][12][13] form the second group. Studies of the mechanical and technological properties (wettability, wear, etc.)…”

Section: Introductionmentioning

confidence: 99%

“…Study of the wettability of Sn-Zn alloys on Cu and Ni substrates by Zhang et al 7 showed that the contact angle (wettability) of Sn-9Zn alloy is about three times higher at 250°C compared with that of Sn-37Pb alloy. As shown by Garcia et al, 10 increase of the Zn content in the Sn-9Zn alloy does not improve its wettability.…”

Section: Introductionmentioning

confidence: 99%

Physicochemical Properties of Sn-Zn and SAC + Bi Alloys

Gancarz

Pstruś

Gąsior

et al. 2012

Journal of Elec Materi

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Applying the discharge crucible (DC) method, the viscosity, density, and surface tension were determined for Sn-9Zn and Sn-2.92Ag-0.4Cu-3.07Bi (SAC + Bi) alloys. For comparison, the dilatometric, maximum bubble pressure, and capillary flow methods were used for measurements of these same physicochemical properties for the Sn-2.92Ag-0.4Cu-3.07Bi (SAC + Bi) alloy. The measurements were performed for Sn-9Zn and SAC + Bi alloys in the temperature range from 513 K to 723 K and 530 K to 1180 K, respectively. The experimental data obtained show that addition of Bi to SAC increases the density and decreases the surface tension and viscosity in comparison with SAC solder. Additionally it was found that the properties studied by different methods (maximum bubble pressure, dilatometric, capillary flow, and discharge crucible) were almost identical.

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“…The main trend of research is to find replacements for lead solder with low-and hightemperature properties similar to those of toxic solders containing Pb and Cd, which are characterized by melting points above 473 K and 623 K, respectively, for use in different types of connections, not only as solder alloys for pressure soldering, but also for installation of optical components in industries such as automotive, aerospace, electronics, etc. 4 Eutectic Sn-Zn alloys [5][6][7][8] form the second most interesting group of metallic materials for use in the electronics industry, the first being the triple eutectic Ag-Sn-Cu (SAC) alloys. [9][10][11] The most frequently used solder modifiers for Sn-Zn eutectic are bismuth, indium, and antimony.…”

Section: Introductionmentioning

confidence: 99%

Physicochemical Properties of Sb-Sn-Zn Alloys

Gancarz

2014

Journal of Elec Materi

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In this work, liquid Sb-Sn-Zn alloys were studied to determine their density, viscosity, and surface tension using the discharge crucible method. The measurements were carried out for alloy compositions having X Sn /X Sb ratio of 1, 3, 4, and 9 and Zn content X Zn of 0.05, 0.1, 0.2, and 0.7 in the temperature range from 550 K to 1050 K. The effect of the Zn concentration in the Sb-SnZn alloys on their density, viscosity, and surface tension was observed. Over a wide temperature range, the viscosity and surface tension increased with increasing Zn content in the alloy, while the density decreased. The experimental results obtained for surface tension and viscosity were compared with the results of the Butler model for surface tension and with the MoelwynHughes, Sichen-Boygen-Seetharaman, Seetharaman-Sichen, Kozlov-Romanov-Petrov, and Kaptay models for viscosity.

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Properties of SnAgCu/SnAgCuCe soldered joints for electronic packaging

Cited by 16 publications

References 23 publications

Tensile strength of fine pitch QFP lead‐free soldered joints with diode laser soldering

Tensile strength of fine pitch QFP lead‐free soldered joints with diode laser soldering

Physicochemical Properties of Sn-Zn and SAC + Bi Alloys

Physicochemical Properties of Sb-Sn-Zn Alloys

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