2011
DOI: 10.1007/s10854-011-0499-2
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Properties of synthetic diamond and graphene nanoplatelet-filled epoxy thin film composites for electronic applications

Abstract: Epoxy thin film composites filled with particulate nanofillers; synthetic diamond and graphene nanoplatelets were prepared and characterized based on tensile, thermal, and electrical properties. The influences of these two types of fillers, especially in terms of their loading, sizes and shapes, were discussed. It was found that the epoxy thin film composites incorporating synthetic diamond displayed optimum properties where the addition of synthetic diamond from 0 to 2 vol.% results in higher elastic modulus,… Show more

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Cited by 42 publications
(14 citation statements)
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(32 reference statements)
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“…This could be a result of the agglomeration of GNPs at high nanofiller contents in the nanocomposite. [ 30 ]…”
Section: Resultsmentioning
confidence: 99%
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“…This could be a result of the agglomeration of GNPs at high nanofiller contents in the nanocomposite. [ 30 ]…”
Section: Resultsmentioning
confidence: 99%
“…The number of cycles was determined to obtain a homogeneous dispersion while minimizing the loss of material and preventing particle damages from applied energy and residual stresses. [ 13,30 ] The homogeneity of particle dispersion resulted in a good interaction between the reinforced GNPs and matrix. Therefore, mechanical and thermo‐mechanical properties of the nanocomposites increased even at lower GNP contents compared to those of the ultrasonication samples.…”
Section: Resultsmentioning
confidence: 99%
“…f). The agglomeration is caused by stress transfer between epoxy resin and F‐GO accounts for the decrease in tensile and flexural strength . The tensile strength of the epoxy/F‐GO (0.5 wt%) composite increases to 113.88 and 31.62% when compared with neat epoxy and epoxy/GO (0.5 wt%) composites.…”
Section: Resultsmentioning
confidence: 99%
“…In past years, a lot of works have studied thermal conductive polymer-based composites. Many different materials with high thermal conductivity have been used as fillers to improve the thermal conductivity of composites, such as boron nitride (BN) [6,7,8,9], carbon nanotubes (CNTs) [10,11,12,13,14], aluminum oxide [15,16,17], diamond [18,19,20,21], and graphene [22,23].…”
Section: Introductionmentioning
confidence: 99%