Thin Solid Films
 2019
DOI: 10.1016/j.tsf.2019.01.051
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Properties of tungsten thin film deposited using inductively coupled plasma assisted sputtering for next-generation interconnect metal

Soo Jung Lee
1
,
Tae Hyung Kim
2
,
Byeong-Hwa Jeong
3
et al.
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Cited by 9 publications
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References 35 publications
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Hard and tough nitrogen doped tungsten coatings deposited by HIPAC: Microstructure and mechanical properties

Zou
1
,
Hong
2
,
Wang
3
et al. 2021
Journal of Alloys and Compounds
2
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Hard and tough nitrogen doped tungsten coatings deposited by HIPAC: Microstructure and mechanical properties

Zou
1
,
Hong
2
,
Wang
3
et al. 2021
Journal of Alloys and Compounds
2
0
0
0
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Surface sintering of tungsten powder targets designed by electromagnetic discharge: A novel approach for film synthesis in magnetron sputtering

Wicher
1
,
Zdunek2,
Choduń3
et al. 2020
Materials & Design
7
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Development of B and BN thin films for in situ neutron beam monitoring

Lee
1
,
Park
2
,
Jin
3
et al. 2022
Nuclear Engineering and Design
1
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