This paper describes a research project in which tantalum boride (TaB x ) films were deposited on silicon substrates by radio frequency ͑rf͒ magnetron sputtering of a TaB 2 alloy target. The deposition rate, chemical composition, crystalline microstructure, and sheet resistivity were examined by transmission electron microscopy, X-ray photoelectron spectroscopy, X-ray diffraction, scanning electron microscopy, and sheet resistance measurements. The results indicate that the deposition rate, film composition, and microstructure correlate closely with the bias. The deposition mechanism and kinetic model which control the film characteristics are presented here as well.Due to their high thermodynamic stability, hardness, excellent electrical conductivity, and high melting points, refractory metal borides are widely recognized as an attractive class of materials for a wide range of mechanical applications in abrasive, erosive, corrosive, and high-temperature environments. Most studies to date have focused on the borides of Ti, Zr, Hf, Cr, and W.