Pulse durability of thin-film resistors embedded in printed circuit boards

Kłossowicz, Adam; Winiarski, Paweł; Dziedzic, Andrzej

doi:10.1109/stysw.2011.6155846

Cited by 6 publications

(7 citation statements)

References 2 publications

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“…All the measurements, advanced characterizations and analyses presented above for various passive components embedded in Printed Circuit Boards as well as other our investigations not discussed in this paper (characterization of multiterminal thin-film resistors embedded in PCBs [18], determination and comparison of transient and steady-state thermal properties of thin-film, polymer and cermet thick-film as well as LTCC resistors [19], characterization of pulse durability of thin-film and polymer thick-film embedded PCB resistors [20], determination of chosen electrical and long-term stability properties of embedded capacitors and RC filters, especially with the aid of impedance spectroscopy [21,22], electrical and long-term stability characterization of planar PCB inductors [23]) confirmed that such passives with small and medium values of resistance, capacitance or inductance exhibit basic electrical properties and long-term thermal stability level acceptable for many consumer applications. …”

Section: Discussionmentioning

confidence: 93%

Chosen electrical, noise and stability characteristics of passive components embedded in printed circuit boards

Dziedzic

Kłossowicz

Winiarski

et al. 2014

Proceedings of the 5th Electronics System-Integration Technology Conference (ESTC)

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This paper presents systematic studies of electrical, noise and long-term stability parameters of resistors (thinfilm or polymer thick-film) and capacitors embedded in Printed Circuit Boards (PCBs). The temperature dependence of resistance or capacitance were determined in a wide temperature range (from -180 o C to 130 o C) and analyzed as a function of geometry of passives and cladding process. The in-situ accelerated ageing process (basic properties of passives measured directly at ageing conditions) was carried out to perform long-term behavior analysis. Low frequency noise measurements were made in room temperature using noise spectra measurements in dc bridge configuration.The R(T) characteristics are linear with almost constant, negative value of differential TCR (of about -60 ppm/K for 100 Ω/sq Ni-P resistors). Both groups of investigated resistors revealed similar range of relative resistance changes after ageing processes but the results showed the quite different behavior of both groups versus time. It means that the dynamics of ageing changes was different. Only positive resistance changes were observed for Ni-P resistors, whereas the shape of characteristics for polymer ones were much more complex, exhibited increase as well as decrease in resistance under environmental exposure. 1/f noise generated by resistance fluctuations was found as the main noise component but the significant difference of noise level was observed for both groups of investigated resistors.The C(T) characteristics are nonlinear with larger capacitance changes at higher temperature. Capacitors exposed to elevated temperature exhibited capacitance and dissipation factor decrease. The relative changes were from the range from -12% to -2% for capacitance and up to -60% for dissipation factor. The value of relative drift of parameters was dependent strongly on dielectric composition and size. Moreover the results revealed nonlinear characteristics in temperature domain as well.

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Section: Discussionmentioning

confidence: 93%

Chosen electrical, noise and stability characteristics of passive components embedded in printed circuit boards

Dziedzic

Kłossowicz

Winiarski

et al. 2014

Proceedings of the 5th Electronics System-Integration Technology Conference (ESTC)

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“…Similar investigations were described in other works Kłossowicz et al, 2012;Nicolics et al, 2007). The motivation to undertake this study was to compare the performance of embedded components to standard ones assembled in surface mount technology.…”

Section: Introductionmentioning

confidence: 83%

“…Because of the fact that the each structure was constructed of materials with various emissivity coefficients, the measurement of temperature could be affected by errors. For this reason, the resistors for the thermographic tests were covered by black acrylic paint with a known emissivity coefficient (Kłossowicz et al, 2012). Also, because thermography is based on a radiation measurement of the whole observed area, its emissivity must be known.…”

Section: Methodsmentioning

confidence: 99%

Thermal effects in embedded thin- and thick-film resistors in comparison to chip resistors

et al. 2014

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Purpose -The purpose of this paper is to investigate the thermal behaviour of thin-and thick-film resistor with different dimensions and contacts embedded into printed circuit board (PCB) and compare them to the similar constructions of discrete chip resistors assembled to standard PCBs. Design/methodology/approach -In investigations the thin-and thick-film embedded resistors with the bar form in different dimensions and configurations of contacts as well as rectangular chip resistors in package 0603 and 0402 were used. In tests were carried out the measurements of dissipated power in temperature of resistor about 408C, 708C and 1558C. The power dissipation was calculated as a multiplying of electrical current flowing through the resistor with voltage across the resistor. The dissipation of heat generated by electrical current flowing through resistors was examined by means of the FLIR A320 thermographic camera with lens Closeup £ 2 and the power source. Findings -The results show that, in case of chip resistors, the intensity of heat radiation strongly depends on dimensions of copper contact lands and also depends on the dimensions of the resistor. In case of embedded resistors, with comparable dimensions to chip resistors, they have lower ability to power dissipation, as well as the copper contact lands dimensions have lower influence. The thermal radiation through resin material is not as effective as it is in case of resistors assembled on PCB. However, the embedded thick-film resistors, especially made of paste Minico M2010, have already the similar parameters to 0402 chip resistors. Research limitations/implications -Research shows that embedded resistors can be used interchangeably with SMD resistors it allows to open up space on the surface of PCB, but it should be taken into account the lower energy dissipation capabilities. It is suggested that further studies are necessary for accurately determining the thermal effects and investigate the structures of embedded passive components that allow for better heat management. Originality/value -Thermal stability of embedded resistors during operation is a critical factor of success of embedded resistor technology. The way of power dissipation and heat resistance are one of the important operating parameters of these components. The results provide information about the power and the energy dissipation of embedded thin-and thick-film resistors compared to the standard surface mount technology.

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“…Knowing the importance of this issue authors undertook extensive research of reliability of above embedded passives. Presented work is a supplementary of so far made research, which referred mainly to resistors [9][10][11].…”

Section: Introductionmentioning

confidence: 99%

Analysis of long-term stability of capacitors embedded in printed circuit boards

Kłossowicz

Winiarski

Zawierta

et al. 2014

Proceedings of the 2014 37th International Spring Seminar on Electronics Technology

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This paper presents studies of long-term stability of capacitors embedded in printed circuit boards. Planar capacitors fabricated from FaradFlex dielectric foil with copper plates laminated to FR-4 substrate served as test structures. The dielectric was BaTiO 3 ceramic/polymer composition with various fillers and consequently various dielectric constants. Moreover test samples differed in composition thickness and surface size. The investigated capacitors were covered with LDP 2×106 (Laser Drillable Prepreg) protective layers to achieve embedded structures. The behaviour of capacitance as well as dissipation factor was investigated for two values of frequency (1 and 10 kHz) in order to determine their long-term stability. The in-situ accelerated ageing process (capacitance and dissipation factor of test samples performed directly at the ageing conditions) was carried out to perform long-term behaviour analysis. Temperature characteristics both before and after aging process were performed for determination of influence of environmental exposure. Additionally insulation resistance under voltage and temperature stress was monitored and analyzed.

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Pulse durability of thin-film resistors embedded in printed circuit boards

Cited by 6 publications

References 2 publications

Chosen electrical, noise and stability characteristics of passive components embedded in printed circuit boards

Chosen electrical, noise and stability characteristics of passive components embedded in printed circuit boards

Thermal effects in embedded thin- and thick-film resistors in comparison to chip resistors

Analysis of long-term stability of capacitors embedded in printed circuit boards

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