1993
DOI: 10.1016/0257-8972(93)90248-m
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Pulsed magnetron sputter technology

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Cited by 318 publications
(117 citation statements)
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“…Some limitations are however obvious such as low target utilization, low ionization of the sputtered material and risk of arc generation in reactive sputter deposition of dielectric materials. Some of these problems have been alleviated by pulsing the applied voltage [19,20], others by additional ionization by rf [21] or microwave [22] power or by increased magnetic confinement [23].…”
Section: Introductionmentioning
confidence: 99%
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“…Some limitations are however obvious such as low target utilization, low ionization of the sputtered material and risk of arc generation in reactive sputter deposition of dielectric materials. Some of these problems have been alleviated by pulsing the applied voltage [19,20], others by additional ionization by rf [21] or microwave [22] power or by increased magnetic confinement [23].…”
Section: Introductionmentioning
confidence: 99%
“…Asymmetric bipolar pulsing in the medium frequency range (10-250 kHz), has become established as one of the main techniques for deposition of oxide and nitride films [19,24]. Unipolar pulsing, which is applied in the experiment described here, utilizes short high power pulses but operates at fairly normal average power levels due to a low duty factor of less than 1%.…”
Section: Introductionmentioning
confidence: 99%
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“…During such arcing micro particles may be formed resulting in a coating with undesirable inclusions of micro particles. To overcome this problem it has become quite popular to use a pulsed direct current (DC) power in the form of high negative pulses interrupted by small positive pulses (arc suppression) [19][20]. In this way the charge at the oxide surface on the target may be neutralized by attracting electrons during the positive part of the duty cycle.…”
Section: Introductionmentioning
confidence: 99%
“…7,21,22 The development of high-power semiconductor switches allowed the fabrication of power supplies for pulsed magnetrons operating in mid-frequency range of 10-100 kHz, and in some cases up 350 kHz. 7,[23][24][25] This has the advantage that arcing processes are reduced to a level that arcing do not significantly affect the quality of the sputter-deposition process. 7,19 Power supplies with asymmetric bi-polar voltage and current pulse shapes are designed to sputter targets at negative pulse polarity and remove accumulated surface charge by allowing plasma electrons to arrive on the surface during positive polarity phase of the pulse cycle.…”
mentioning
confidence: 99%