We have investigated, by using Monte Carlo simulations,
the effects of channel thickness on the breakdown dynamics
in InP-based lattice-matched HEMTs (LM-HEMTs). Breakdown
is due to the parasitic bipolar action of holes generated by impact
ionization and accumulated in the low electric field regions
near the source. Our results show that channel shrinking results in
an increase in time-to-breakdown values due to holes real-spacetransfer
effects occurring in thin channel devices. The breakdown
behavior of thin-channel devices (channel thickness 20 nm) is
dominated by the accumulation of holes in the InAlAs buffer layer;
in thick-channel devices breakdown is due to the parasitic bipolar
action of holes accumulating in the InGaAs channel. These results
suggest a frequency dependence of breakdown which can be relevant
for power rf device applications and/or in the study of device
survivability to rf overstress