2011
DOI: 10.4236/jmp.2011.25049
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Pulsed Supermagnetron Plasma CVD of a-CN<sub>x</sub>:H Electron-Transport Films for Au/a-CN<sub>x</sub>:H/p-Si Photovoltaic Cells

Abstract: Hydrogenated amorphous carbon nitride (a-CN x :H) films were formed on p-Si wafers set on a lower electrode by pulsed supermagnetron plasma CVD using i-C 4 H 10 and N 2 gases. Lower electrode RF power (LORF) of 13.56 MHz (50-800 W) was modulated by a 2.5-kHz pulse at a duty ratio of 12.5%, and upper electrode RF power (UPRF) of 50-400 W was supplied continuously. The optical band gap decreased with an increase in LORF at each UPRF. The open circuit voltage of Au/a-CN x :H/p-Si photovoltaic cells (a-CN x :H fil… Show more

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Cited by 8 publications
(15 citation statements)
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“…The a-CN x :H films were deposited at a gas pressure of 4 Pa. Figure 2 shows the LORF (0 -800 W) dependence of the on-time deposition rate measured at a UPRF of 100 W. The on-time deposition rate changed a little between 200 and 400 W, being about 27 and 35 nm/min, respectively. During the off-time of LORF, the wafer temperature naturally sank below that of the wafer exposed to continuous discharge plasma [9] [23].…”
Section: Resultsmentioning
confidence: 99%
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“…The a-CN x :H films were deposited at a gas pressure of 4 Pa. Figure 2 shows the LORF (0 -800 W) dependence of the on-time deposition rate measured at a UPRF of 100 W. The on-time deposition rate changed a little between 200 and 400 W, being about 27 and 35 nm/min, respectively. During the off-time of LORF, the wafer temperature naturally sank below that of the wafer exposed to continuous discharge plasma [9] [23].…”
Section: Resultsmentioning
confidence: 99%
“…Gold ohmic electrodes 30-nm thick, and semitransparent in visible light were deposited for the PVCs (Figure 16 a-CN x :H thicknesses of 5 and 12.5 nm, respectively (Yamashita Denso YSS-80A with AM1.5G, 100 mW/cm 2 , calibrated by a reference Si photodiode BS-520) [36] [37]. They showed a rectifying curve in the dark, indicating the formation of a heterojunction between the a-CN x :H film and p-Si substrate [9] [10]; an a-SiC x mixed layer about 2-nm thick would be formed at the heterojunction interface [38].…”
Section: Resultsmentioning
confidence: 99%
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“…However, they must be deposited at high temperatures of 700−1000°C, which is too high to deposit on low-cost glass substrates [6,7]. a-CN x :H films can be deposited at temperatures below about 400°C [8,9], and show excellent electron field emission characteristics from their flat surfaces [2,[10][11][12]. For cold cathode operation of devices such as flat-panel displays and panel light sources, a large-area electron emission with a low working voltage is required.…”
Section: Introductionmentioning
confidence: 99%