Purification of dialkylzinc precursors using tertiary amine ligands

Smith, Lesley M.; Coward, K.M.; Jones, Anthony; Bickley, Jamie F.; Steiner, Alexander; Petroni, Simona; Roberts, J.S.

doi:10.1007/s11664-001-0198-5

Cited by 3 publications

(2 citation statements)

References 20 publications

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“…For example, pure Me 2 Zn can be obtained by purification of and subsequent thermal decomposition of Me 2 ZnNEt 3 , Figure 10c. 44 DFT calculations suggest that the donor bond in this adduct is weak with a bond energy of 46 kJ mol −1 and a bond length of 2.27 Å which is larger than the sum of the covalent radii of 1.93 Å. All of the weak donor bonds examined by Haaland had, like Me 2 ZnNEt 3 , their atom charges associated with the donor bond aligned against electronegativity.…”

Section: ■ Important Difference Between Covalent and Donor Bondsmentioning

confidence: 87%

“…High purity materials required for doping in the electronics industry can be prepared by this type of adduct formation followed by subsequent thermal decomposition of the adduct. For example, pure Me 2 Zn can be obtained by purification of and subsequent thermal decomposition of Me 2 ZnNEt 3 , Figure c . DFT calculations suggest that the donor bond in this adduct is weak with a bond energy of 46 kJ mol –1 and a bond length of 2.27 Å which is larger than the sum of the covalent radii of 1.93 Å.…”

Section: Important Difference Between Covalent and Donor Bondsmentioning

confidence: 99%

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Systematic Procedure for Drawing Lewis Structures Based on Electron Pairing Priority and the Explicit Use of Donor Bonds: An Alternative to the Normal Procedure Which Can Be Pen and Paper Based or Automated on a PC in User Interactive 3D

McArdle

2019

J. Chem. Educ.

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This article contrasts the normal method for drawing Lewis structures with a two-step systematic approach. The latter approach uses a known molecular connectivity and a knowledge of the number of valence electrons that each atom possesses to visualize bonds that are formed by pairing electrons, one from each atom. This process is repeated until at least one of the non-hydrogen atoms in each bond has an octet. Donor bonds are added when atoms with six and eight electrons are adjacent. In forming donor bonds charges are added to the atoms involved to maintain electron accounting and there is no need to use a formula to calculate formal charges. The general importance of adhering to the octet rule for p-block compounds is stressed and the difference between covalent and donor bonds and the use of the recent IUPAC definition of oxidation state which is based on Lewis structures is included in the discussion. When students are able to draw Lewis structures they can be given access to PC software, available on an academic free basis, which will draw rotatable Lewis structures in 3D for p-block compounds. The software allows the user to move electron pairs in a bow and arrow fashion within the structures and atoms are highlighted when the octet is exceeded.

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Section: ■ Important Difference Between Covalent and Donor Bondsmentioning

confidence: 87%

Section: Important Difference Between Covalent and Donor Bondsmentioning

confidence: 99%

Systematic Procedure for Drawing Lewis Structures Based on Electron Pairing Priority and the Explicit Use of Donor Bonds: An Alternative to the Normal Procedure Which Can Be Pen and Paper Based or Automated on a PC in User Interactive 3D

McArdle

2019

J. Chem. Educ.

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Dissolution behaviors of the Ni and Ni<inf>3</inf>Sn<inf>4</inf> phase in molten lead-free solders

Yen

Kuo

Liou

et al. 2012

2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

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Dissolution behavior of the Ni substrate and Ni₃Sn₄ phase in molten lead-free solders

Yen

Lin

Yan

et al. 2018

Int. J. Mod. Phys. B

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The dissolution behavior of the Ni substrate and Ni3Sn4 phase was studied in the following molten lead-free solders: Sn, (wt.%) Sn–3.0Ag–0.5Cu (SAC), Sn–0.7Cu (SC), Sn–58Bi (SB) and Sn–9Zn (SZ) at 240[Formula: see text]C, 270[Formula: see text]C and 300[Formula: see text]C. The dissolution rate of the Ni substrate in solder decreased from Sn, SAC, SC, SB, to SZ. The thick Ni5(Zn, Sn)[Formula: see text] phase formed at the SZ/Ni interface hindering the Ni dissolution. Ni3Sn4 phase dissolution rate in molten solder decreased from Sn, SZ, SAC, SC, to SB at 240[Formula: see text]C and SC, Sn, SAC, SZ, to SB at 300[Formula: see text]C. The (Cu, Ni)6Sn5 phase spilling was observed at the SAC/Ni3Sn4 and SC/Ni3Sn4 interfaces. Zn in the SZ solder reacted with the Ni3Sn4 phase to form the (Ni, Sn)5Zn[Formula: see text] phase at the interface.

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Purification of dialkylzinc precursors using tertiary amine ligands

Cited by 3 publications

References 20 publications

Systematic Procedure for Drawing Lewis Structures Based on Electron Pairing Priority and the Explicit Use of Donor Bonds: An Alternative to the Normal Procedure Which Can Be Pen and Paper Based or Automated on a PC in User Interactive 3D

Systematic Procedure for Drawing Lewis Structures Based on Electron Pairing Priority and the Explicit Use of Donor Bonds: An Alternative to the Normal Procedure Which Can Be Pen and Paper Based or Automated on a PC in User Interactive 3D

Dissolution behaviors of the Ni and Ni<inf>3</inf>Sn<inf>4</inf> phase in molten lead-free solders

Dissolution behavior of the Ni substrate and Ni₃Sn₄ phase in molten lead-free solders

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Purification of dialkylzinc precursors using tertiary amine ligands

Cited by 3 publications

References 20 publications

Systematic Procedure for Drawing Lewis Structures Based on Electron Pairing Priority and the Explicit Use of Donor Bonds: An Alternative to the Normal Procedure Which Can Be Pen and Paper Based or Automated on a PC in User Interactive 3D

Systematic Procedure for Drawing Lewis Structures Based on Electron Pairing Priority and the Explicit Use of Donor Bonds: An Alternative to the Normal Procedure Which Can Be Pen and Paper Based or Automated on a PC in User Interactive 3D

Dissolution behaviors of the Ni and Ni<inf>3</inf>Sn<inf>4</inf> phase in molten lead-free solders

Dissolution behavior of the Ni substrate and Ni3Sn4 phase in molten lead-free solders

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Dissolution behavior of the Ni substrate and Ni₃Sn₄ phase in molten lead-free solders