2013
DOI: 10.1051/epjap/2013120484
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PwrSoC (integration of micro-magnetic inductors/transformers with active semiconductors) for more than Moore technologies

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Cited by 9 publications
(2 citation statements)
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“…This area has been mentioned in almost 40% of the papers analyzed in this work [15], [22], [24], [31], [39], [40], [42]- [47], [50], [52], [54], [58], [59], [62], [66], [67], [70]- [73], [79]- [81], [84]- [91], [93]- [99], [101], [105], [116], [120]- [122], [131]- [134]. Some of the examples of specific applications in this area are DC-DC converters, energy harvesting, and power systems on chip.…”
Section: A Energy Conversionmentioning
confidence: 85%
“…This area has been mentioned in almost 40% of the papers analyzed in this work [15], [22], [24], [31], [39], [40], [42]- [47], [50], [52], [54], [58], [59], [62], [66], [67], [70]- [73], [79]- [81], [84]- [91], [93]- [99], [101], [105], [116], [120]- [122], [131]- [134]. Some of the examples of specific applications in this area are DC-DC converters, energy harvesting, and power systems on chip.…”
Section: A Energy Conversionmentioning
confidence: 85%
“…In-package converters combine different technologies to integrate the switching cell, and the passive and control in the same package as the powered circuit [1]. Using non-standard processes such as deep-trench capacitors [2], magnetics on silicon [3] or wide band-gap technology [4] lead to the converter being potentially smaller and having a higher power efficiency than an on-die solution, though the 3D heterogeneous assembly of the converter and its load could be a cost issue. The second integration level i.e.…”
Section: Introductionmentioning
confidence: 99%