“…The R h , has not yet attracted much attention because of its direct proportionality to the sheet resistance of the TCO. It can be controlled by controlling the thickness of the fluorine-doped tin oxide (SnO 2 :F) film on the glass substrate, the substrate temperature at SnO 2 :F deposition [5,12,13], the thickness of the metal grid that is deposited on the FTO glass substrate [14], the thicknesses of the non-noble metals (Ni, Cu, and Al), which are deposited on the FTO glass substrate by dc magnetron sputtering [7]. However, increasing the thickness of SnO 2 :F can reduce the transmittance of TCO [5].…”