Qualification of Underfills, Fluxes and Solder Resist for Flip Chip Applications

Tuominen, Aulis; Lehtinen, V.; Ristolainen, Eero

doi:10.5796/electrochemistry.67.850

Search citation statements

Order By: Relevance

Paper Sections

Select...

Introduction1

Citation Types

Supporting

Mentioning

Contrasting

Year Published

2000

Publication Types

Select...

Article1

Relationship

Self Cite1

Independent0

Authors

Journals

Cited by 1 publication

(1 citation statement)

References 7 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…We have tested three different fluxes and four underfills together with three different pad geometries . The materials were selected in the previous flux (Tuominen et al, 1999a) and underfill (Tuominen et al, 1999b) qualification tests. The monitoring of the test chips was carried out by using a four-probe method in by-pass diode connected chain .…”

Section: Introductionmentioning

confidence: 99%

Reliability of flip chip components soldered on FR5 board

Maattanen¹,

Palm²,

Tuominen

2000

Microelectronics International

Self Cite

View full text Add to dashboard Cite

To achieve good reliability and high performance flip chip interconnection, process parameters and materials used in the flip chip process must be optimised. In this paper reliability of Sn37Pb solder bumped flip chips on an FR5 board, using different fluxes and underfill materials, are tested in a temperature cycling test. Also the contact pad geometry used on the FR5 board had a great influence on the reliability of the joint. The solder bumps were grown on the well‐known TiW/Au under bump metallurgy (UBM1) with an extra layer of nickel (UBM2) which gives a reliable and high performance solder joint.

show abstract

Section: Introductionmentioning

confidence: 99%