Reliability of flip chip components soldered on FR5 board

Maattanen, J.; Palm, P.; Tuominen, Aulis

doi:10.1108/13565360010306038

Search citation statements

Order By: Relevance

Paper Sections

Select...

Citation Types

Supporting

Mentioning

Contrasting

Year Published

2001

Publication Types

Select...

Article1

Other1

Relationship

Self Cite0

Independent2

Authors

Journals

Cited by 2 publications

References 4 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

Reliability of FCOB with and without encapsulation

Zhong

2001

Soldering &Amp; Surface Mount Technology

View full text Add to dashboard Cite

Flip chips were assembled on to ceramic boards using eutectic tin‐lead solder with underfill and with/without encapsulation for temperature cycling and high‐temperature‐high‐humidity tests. After 1.5 years of testing, the reliability performance of the flip chip on board (FCOB) assemblies was compared. All of the FCOB assemblies with underfill, but without encapsulation, survived 5,778 cycles of the temperature cycling test following 5,005 hours of the high‐temperature and high‐humidity test. The results show that encapsulation may not necessarily enhance the reliability of flip chip assemblies and might therefore be omitted.

show abstract