Reliability of FCOB with and without encapsulation

Abstract

Flip chips were assembled on to ceramic boards using eutectic tin‐lead solder with underfill and with/without encapsulation for temperature cycling and high‐temperature‐high‐humidity tests. After 1.5 years of testing, the reliability performance of the flip chip on board (FCOB) assemblies was compared. All of the FCOB assemblies with underfill, but without encapsulation, survived 5,778 cycles of the temperature cycling test following 5,005 hours of the high‐temperature and high‐humidity test. The results show that encapsulation may not necessarily enhance the reliability of flip chip assemblies and might therefore be omitted.

Recent advances in wire bonding, flip chip and lead‐free solder for advanced microelectronics packaging

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“…To evaluate the reliability performance of IC packages, various reliability tests are carried out, which are usually time-consuming [1][2][3]. Therefore, another approach becomes popular and useful, which is to predict the fatigue life by simulating and analyzing the deformations, stresses and strains of the packages using the finite element methods [4,5].…”