Quantifying thermal transport in buried semiconductor nanostructures via cross-sectional scanning thermal microscopy

Abstract

Managing thermal transport in nanostructures became a major challenge in development of active microelectronic, optoelectronic and thermoelectric devices, stalling the famous Moore’s law of clock speed increase of microprocessors for...

Engineering Interfacial Effects in Electron and Phonon Transport of Sb2Te3/MoS2 Multilayer for Thermoelectric ZT Above 2.0

“…As the heat spreading in the layered sample on a substrate is directly affected by the anisotropy of its thermal conductivity, by fitting the xSThM measured dependence of the thermal resistance on the wedge thickness, t , in the point of contact via analytical Muzychka–Spièce model, we will obtain both the in‐plane ( k xy ) and out‐of‐plane ( k z ) values of thermal conductivity. [ 33,34 ] The total thermal resistance measured, R X ( t ) is a sum of the constant thermal resistance of the probe‐sample contact, R C , and the spreading thermal resistance, R S ( t ) [ 33 ] $$\[ \begin{array}{*{20}{c}}{{R_X}\left( t \right) = {R_S}\left( t \right) + {R_C}}\end{array} \]$$…”

“…al. for larger systems [ 33 ] make the present technique most flexible in terms of the thickness of samples and complexity of the structures.…”

Untangling heat transport dynamics using luminescence nanothermometry

“…8 Although non-diffusive thermal transport has been observed in nanoparticles, 9,10 nanoparticle disordered lms, 11 and nanowire arrays, 12 studying thermal dynamics and discriminating between heat propagation regimes remains a big challenge, especially for nano uids. Current techniques including time-domain thermore ectance, 13 scanning thermal microscopy, 14 transient thermal grating, 15 and other microscale imaging techniques 16 are relatively complex and limited only to surface probing.…”

“…Luminescent thermometers with spatially-delayed temperature sensing were synthesized by hot-injection thermal decomposition which facilitates layer-by-layer growth of the UCNPs and allows to place Ln 3+ dopants at the designated positions, henceforth thermometric layers (Supplementary Section I, Figs. [1][2][3][4][5][6][7][8][9][10][11][12][13][14]. Er 3+ ,Yb 3+ and Tm 3+ ,Yb 3+ co-dopants were rationally introduced in the NaGdF 4 host (Fig.…”

Low thermal conductivity in franckeite heterostructures

“…With the use of a diffusive thermal transport model for layered material on a substrate, we express R s as a function of the layer thickness and the thermal conductivities of the substrate and the material. 19,[23][24][25][26] By fitting the data for each temperature we extract the cross-plane (k c ) and in-plane (k i ) thermal conductivity (see Experimental section and ESI note 3 † for more details on the modelling, fitting procedure and accuracy).…”