2018
DOI: 10.1109/tpel.2017.2756449
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Questionnaire-Based Discussion of Finite Element Multiphysics Simulation Software in Power Electronics

Abstract: A questionnaire-based survey was carried out to determine the customers' requirements and the future expectations of Multi-Physics Simulation Software (MPSS) based on the finite element method (FEM) in various applications of power electronics. For this survey, several responses was collected from MPSS users in the power electronic industry and academia. Based on the survey, the current features of MPSS are analyzed, and the recent advancements made are ascertained. Also, the drawbacks of the current MPSS offe… Show more

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Cited by 19 publications
(11 citation statements)
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“…A three-dimensional geometry model is constructed in Solidworks, the static mechanical and thermo-mechanical finite element analysis are conducted by ANSYS. With the mesh becoming much refined, the stress intensity factor becomes larger [36]. The sharp re-entrant corners of the geometric model or corners of the metal layers induce the singularities that leading to the occurrence of stress concentrations.…”
Section: Mesh Sensitivity Studymentioning
confidence: 99%
“…A three-dimensional geometry model is constructed in Solidworks, the static mechanical and thermo-mechanical finite element analysis are conducted by ANSYS. With the mesh becoming much refined, the stress intensity factor becomes larger [36]. The sharp re-entrant corners of the geometric model or corners of the metal layers induce the singularities that leading to the occurrence of stress concentrations.…”
Section: Mesh Sensitivity Studymentioning
confidence: 99%
“…Thermal modeling of the PCB has been considered as an effective way to evaluate the capability of thermal diffusion of the PCB and to estimate components' temperature [1][2][3][4][5][6][7][8][9][10][11][12][13][14]. Historically, some modeling methods of analyzing the effective thermal conductivity of the PCB structure were investigated, such as the method of deriving the lumped thermal conductivity of the PCB [1,2] and the method of deriving the discrete thermal conductivity of orthogonal anisotropy (x, y, z direction in Cartesian coordinate) based on the PCB wiring diagram [3,4].…”
Section: Introductionmentioning
confidence: 99%
“…Analytical methods can be applied only in homogeneous ambient conditions and in simple geometries. Therefore, various numerical models have been developed to examine current carrying capacity of cables in various mounting situations [13,14,28]. COMSOL is a suite of finite element modeling software with a predefined set of physics interfaces.…”
Section: Introductionmentioning
confidence: 99%