Quick assessment methodology for reliability of solder joints in ball grid array (BGA) assembly—Part I: Creep constitutive relation and fatigue model

In the present study, a facility, i.e., a mechanical deflection system (MDS), was established and applied to assess the long-term reliability of the solder joints in plastic ball grid array (BGA) assembly. It was found that the MDS not only quickly assesses the long-term reliability of solder joints within days, but can also mimic similar failure mechanisms in accelerated thermal cycling (ATC) tests. Based on the MDS and ATC reliability experiments, the acceleration factors (AF) were obtained for different reliability testing conditions. Furthermore, by using the creep constitutive relation and fatigue life model developed in part I, a numerical approach was established for the purpose of virtual life prediction of solder joints. The simulation results were found to be in good agreement with the test results from the MDS. As a result, a new reliability assessment methodology was established as an alternative to ATC for the evaluation of long-term reliability of plastic BGA assembly.

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Quick assessment methodology for reliability of solder joints in ball grid array (BGA) assembly—Part II: Reliability experiment and numerical simulation

Xunqing

Pang

Yang

et al. 2002

Acta Mech Sinica

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Interaction behavior for multiple embedded cracks subjected to bending load in creep regimes

Gao

Zhao

2023

Journal of Mechanics

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Multiple cracks grow from pre-existing defects during the manufacturing/installation process or from small cracks initiated are primary concerns in evaluating the structural integrity. In this study, the interaction behavior for coplanar multiple embedded cracks subjected to bending load in creep regimes was studied using numerical simulation approach. Influences of crack configurations (crack shape, crack depth and crack distance) and creep properties on creep interaction factor and C* distribution along the embedded cracks were evaluated based on the three-dimensional finite element solutions. Due to the interaction among the multiple cracks, the C* distribution was asymmetric along the crack front and the C* values were pronounced as the cracks approached each other. Moreover, crack depth, crack distance and creep exponent significantly affected the creep interaction factor and crack shape had limited influence. However, the maximum creep interaction factor did not coincide with the maximum C* values occurring along the crack front. The creep interaction factor determined by the average C* values along the crack front was employed to represent the intensity effect of multiple embedded cracks on the crack growth behavior. Finally, an empirical relation was proposed for estimating crack creep interaction factors of embedded cracks.

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In-Situ Micro-Digital Image Speckle Correlation Technique for Characterization of Materials' Properties and Verification of Numerical Models

Shi

Pang

Zhang

et al. 2004

IEEE Trans. Comp. Packag. Technol.

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Quick assessment methodology for reliability of solder joints in ball grid array (BGA) assembly—Part I: Creep constitutive relation and fatigue model

Cited by 3 publications

References 15 publications

Quick assessment methodology for reliability of solder joints in ball grid array (BGA) assembly—Part II: Reliability experiment and numerical simulation

Quick assessment methodology for reliability of solder joints in ball grid array (BGA) assembly—Part II: Reliability experiment and numerical simulation

Interaction behavior for multiple embedded cracks subjected to bending load in creep regimes

In-Situ Micro-Digital Image Speckle Correlation Technique for Characterization of Materials' Properties and Verification of Numerical Models

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