Quiet passive cooling of high performance microsystems with additional temperature sensor

Samake, Adama; Kocanda, Piotr; Kos, Andrzej

doi:10.1109/mixdes.2016.7529749

Cited by 7 publications

(3 citation statements)

References 6 publications

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“…The thermal throttling approach used in this work is theoretically described in this section. It is well explained in our previous works (Samake et al , 2016a, 2016b, 2016c, 2017a, 2017b; Kocanda et al , 2016). An additional study has been carried out to showcase the advantage of the approach.…”

Section: Theoretical Investigationsupporting

confidence: 75%

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Effective approach of microprocessor throughput enhancement

Samake¹,

Kocanda

Kos

2019

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Purpose This paper aims to present an effective approach to integrated circuit (IC) throughput enhancement, called TΔT thermal control. It does not require any micro-architectural change of the IC. The only modification is the attachment of an additional temperature sensor at the heatsink boundary. TΔT control technique enables assessment of changes in the dimension of cooling conditions and quick reaction to the dynamic changes in the surrounding environment. As a result, the chip can operate flexibly while minimizing thermal violation. Design/methodology/approach Using additional knowledge about the surroundings, the on-chip temperature is regulated. The approach is first investigated theoretically. To validate the utilized thermal model, the measured temperature values of the designed and fabricated testing device are compared with the simulated one. The authors evaluated the impact of the additional sensor location on the reaction time (RT). Using the Spice model, further investigation helps to verify the hypothesis. Findings The control technique described in this paper showed that the temperature of the chip can be regulated using an additional knowledge of the surrounding environment. It has also been demonstrated that the attachment of an additional temperature sensor close to the cooled surface of the package enables TΔT thermal control technique to react faster (rapid powering up/down of the IC). Therefore, this lowers the risk of shutdown while keeping the temperature close to the thermal limit (the maximal temperature of the chip) for a significant period. The simulation results showed that a higher ambient temperature leads to diminution of the interval in which the on-chip temperature stays almost constant when TΔT technique is used (time shift). Originality/value In this study, a new thermal throttling technique that uses the full physical ability of the chip operating under thermal constraint has been evaluated.

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Section: Theoretical Investigationsupporting

confidence: 75%

“…To achieve this goal, many authors have proposed different tools and approaches. A combination of an active fan and a passive heatsink is the most often used approach (Samake et al , 2016a, 2016b, 2016c). The heat generated in the integrated circuit (IC) is transferred to a heatsink, which is in turn cooled by a fan.…”

Section: Introductionmentioning

confidence: 99%

Effective approach of microprocessor throughput enhancement

Samake¹,

Kocanda

Kos

2019

Self Cite

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“…To prevent overheating, various techniques are used. The most common method is the combination of a passive heat sink and a fan with adjustable rotation speed [1]. In small devices, such as laptops, active heat sinks are implemented.…”

Section: Introductionmentioning

confidence: 99%

Modelling of the Temperature Difference Sensors to Control the Temperature Distribution in Processor Heat Sink

Markowski¹,

Gierczak²,

Dziedzic³

2019

Micromachines

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This paper has three main purposes. The first is to investigate whether it is appropriate to use a planar thick-film thermoelectric sensor to monitor the temperature difference in a processor heat sink. The second is to compare the efficiency of two heat sink models. The third is to compare two kinds of sensors, differing in length. The model of the CPU heat sink sensor system was designed for numerical simulations. The relations between the CPU, heat sink, and the thermoelectric sensor were modelled because they are important for increasing the efficiency of fast processors without interfering with their internal structure. The heat sink was mounted on the top of the thermal model of a CPU (9.6 W). The plate fin and pin fin heat sinks were investigated. Two planar thermoelectric sensors were mounted parallel to the heat sink fins. These sensors monitored changes in the temperature difference between the CPU and the upper surface of the heat sink. The system was equipped with a cooling fan. Switching on the fan changed the thermal conditions (free or forced convection). The simulation results showed the temperature gradient appearing along the sensor for different heat sinks and under different thermal conditions. Comparison of the results obtained in the simulations of the CPU heat sink sensor systems proves that changes in the cooling conditions can cause a strong, step change in the response of the thermoelectric sensor. The results suggest that usage of the pin fin heat sink model is a better solution for free convection conditions. In the case of strong forced convection the heat sink type ceases to be significant.

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Swing-like pool boiling on nano-textured surfaces for microgravity applications related to cooling of high-power microelectronics

et al. 2017

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Here, we demonstrate that heat removed in pool boiling from a heater mimicking high-power microelectronics could be used to facilitate a swing-like motion of the heater before being finally dissipated. This swing-like motion could be beneficial for shedding a large vapor bubble that encapsulates high-power heaters in microgravity where buoyancy force is unavailable for vapor bubble removal. The swing-like motion is propelled by vapor bubble recoil, the force which exists irrespective of gravity and buoyancy. We also demonstrate that this force could be significantly enhanced by depositing on the heater surface supersonically blown polymer nanofibers with cross-sectional diameters below 100 nm. These nanofibers provide additional nucleation sites, resulting in much more frequent bubble nucleation and departure, and thus a higher overall vapor recoil force propelling the heater motion. Such nanofibers strongly adhere to the heater surface and withstand prolonged harsh pool boiling. The measured velocity of the model swing-like heater in Novec 7300 fluid is about 1 cm/s.

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Quiet passive cooling of high performance microsystems with additional temperature sensor

Cited by 7 publications

References 6 publications

Effective approach of microprocessor throughput enhancement

Effective approach of microprocessor throughput enhancement

Modelling of the Temperature Difference Sensors to Control the Temperature Distribution in Processor Heat Sink

Swing-like pool boiling on nano-textured surfaces for microgravity applications related to cooling of high-power microelectronics

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