2011 12th European Conference on Radiation and Its Effects on Components and Systems 2011
DOI: 10.1109/radecs.2011.6131334
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Radiation characterization of a dual core LEON3-FT processor

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Cited by 16 publications
(5 citation statements)
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“…Airbus [52,53] uses the LEON4 high reliable processor board, providing up to 800 million instructions per second (MIPS), as well as the LEON3-based SCOC3 SOC with considerably worse performance. RamonChip [54] implemented one of the most advanced dual-core LEON3-FT devices, namely the GR712RC, which is fabricated on 180 nm complementary metal-oxide-semiconductor (CMOS) and provides up to 200 DMIPS∕million floating-point operations per second (MFLOPS) at 100 MHz, dissipates less than 2 W, and withstands up to 300 krad TID, with SEU tolerance and SEL above 118 MeV ⋅ cm 2 ∕mg. Today, the top LEONbased processor is LEON4-FT (e.g., the GR740 at 65 nm), which includes a quad-core operating at 250 MHz and delivering 425 DMIPS per core; this multicore LEON4 targets up to 4300 DMIPS at 800 MHz and supports both asymmetric and symmetric multiprocessing configurations (AMP or SMP).…”
Section: Survey Of Processing Platforms For Space Applicationsmentioning
confidence: 99%
“…Airbus [52,53] uses the LEON4 high reliable processor board, providing up to 800 million instructions per second (MIPS), as well as the LEON3-based SCOC3 SOC with considerably worse performance. RamonChip [54] implemented one of the most advanced dual-core LEON3-FT devices, namely the GR712RC, which is fabricated on 180 nm complementary metal-oxide-semiconductor (CMOS) and provides up to 200 DMIPS∕million floating-point operations per second (MFLOPS) at 100 MHz, dissipates less than 2 W, and withstands up to 300 krad TID, with SEU tolerance and SEL above 118 MeV ⋅ cm 2 ∕mg. Today, the top LEONbased processor is LEON4-FT (e.g., the GR740 at 65 nm), which includes a quad-core operating at 250 MHz and delivering 425 DMIPS per core; this multicore LEON4 targets up to 4300 DMIPS at 800 MHz and supports both asymmetric and symmetric multiprocessing configurations (AMP or SMP).…”
Section: Survey Of Processing Platforms For Space Applicationsmentioning
confidence: 99%
“…The latest available NASA crosscutting technology roadmap lists key avionics goals to include improved reliability and fault tolerance, increased autonomy, reduced size, weight, and power (SWaP), and commonality across spaceflight and ground processing systems [25]. Long-duration crewed missions, space-based observatories, and solar system exploration will require highly reliable, fault-tolerant systems.…”
Section: Mission Scenarios and Applicationmentioning
confidence: 99%
“…Advanced avionics technologies and approaches are needed to support these challenging missions. Subsection TA11.1.1 of the Chief Technologists Office Technology Roadmap lists the three areas of flight computing that are critical to next-generation needs for science and exploration to include processors, memory, and high-performance flight software [25]. Scalable, multicore processors, co-processors, and memory that have a range of capabilities for fault tolerance and recovery are needed for use in radiation fields to support an increasingly software-intensive onboard environment.…”
Section: Mission Scenarios and Applicationmentioning
confidence: 99%
“…For example, The SPARC AT697 introduced in 2003 has an operating frequency of 66 MHz, uses triple modular redundancy (TMR) for logic soft error protection, and error detection and correction (EDAC) for memory soft error protection [9] [10]. More recent RHBD processors have reached 125 MHz [11].…”
Section: Introductionmentioning
confidence: 99%
“…For instance, the StrongARM design operates at 160 MHz in a 350-nm process and the 180-nm XScale microprocessor operates at 600 to 900 MHz [11] [12]. The 90-nm versions of the XScale microprocessors achieved 1.2 GHz with the cache performance being even higher [13] [14].…”
Section: Introductionmentioning
confidence: 99%