Radiotracer study of adsorption of HSO−4 and SO2−4 ions on a smooth copper electrode in acid and neutral media

Rice-Jackson, L.M.; Horányi, G.; Wiȩckowski, Andrzej

doi:10.1016/0013-4686(91)85270-h

Cited by 43 publications

(18 citation statements)

References 21 publications

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“…Although the atomic concentration of copper on the surface increases, copper may have only an indirect effect on the anion deposition since no sulfate is adsorbed on copper at such negative potentials. 44 From these data, we conclude that sulfate is preferentially adsorbed on the aluminum oxide/hydroxide part of the surface rather than on copper-rich intermetallics where hydrogen evolution occurs. Collectively, these observations may explain the lack of effect of sulfate on the cathodic polarization curves demonstrated in Figure 9.…”

Section: Surfacementioning

confidence: 93%

Sorption of Sulfate and Chloride Anions on a Well-Characterized Al 2024 Electrode

et al. 1998

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We studied sorption processes, adsorption and incorporation, of sulfate and chloride anions on the surface of well-characterized aluminum 2024 alloy using electrochemical, radiochemical, and ultrahigh-vacuum spectroscopic techniques. The measurements were carried out at an open-circuit potential and in the electrode potential range on the negative side of the open-circuit potential (cathodic polarization conditions), at various pH values. The focus was on sorption reversibility as well as on the relationship between anion's surface concentration and the electrode potential. We have found that sorption of sulfate anion is controlled by pH, surface charge, and the stability of aluminum oxide films. We have also found that adsorption of chloride is weaker than sulfate and is more irreversible since chloride incorporation occurs more readily than sulfate. The change in the alloy surface composition and morphology induced by the electrochemical treatment and anion adsorption was monitored by scanning Auger microscopy and energy-dispersive X-ray spectroscopy. The characterization exhibits copper-rich intrusions and extrusions that may act as either local cathodes or anodes in the overall alloy dissolution process. The distribution and evolution of such Cu-rich inclusions under studied experimental conditions were monitored and are reported. The dissolution of aluminum from the alloy affects both sulfate and chloride adsorption/incorporation processes. While sulfate and chloride adsorption have no effect on cathodic current measured in the studied electrode potential range, the high anion surface concentration may have a detrimental effect on the alloy stability, particularly when the beneficial influence of the cathodic polarization (protection) ends.

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Section: Surfacementioning

confidence: 93%

Sorption of Sulfate and Chloride Anions on a Well-Characterized Al 2024 Electrode

et al. 1998

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“…[10,11] Radio-tracer studies proved the presence of sulphate on Cu UPD and Cu surfaces. [12][13][14] For more detailed information on Cu underpotential deposition see, for example, refs. [9,15] and a recent review.…”

Section: Introductionmentioning

confidence: 99%

Heat Effects upon Electrochemical Copper Deposition on Polycrystalline Gold

2010

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Heat effects upon Cu deposition on polycrystalline Au surfaces from sulphuric acid electrolytes were calorimetrically measured. By combination of pyroelectric temperature detection at the backside of a thin electrode foil with pulsed electrochemistry, sensitivities to electrochemical conversions of a few percent of a Cu monolayer (ML), corresponding to about 1 microJ cm(-2) were achieved. We compared the heat evolution upon Cu under potential deposition (UPD), Cu deposition onto a fully developed Cu UPD layer and bulk Cu deposition onto a 300 ML thick Cu layer on Au. The heat effects were measured dependent on the amplitudes of the applied potential steps, that is, the driving forces of the respective reactions. From the differences of the heat effects among the Cu deposition processes, we deduced implications on the reaction mechanisms. For Cu UPD, the heat effects were explicable by the deposition of 1.3 Cu atoms per two electrons flowing to the electrode accompanied by sulphate coadsorption, similar to Cu UPD from sulphuric acid solutions on Au(111). Upon Cu deposition on a Cu UPD layer the heat effects signal considerable anion coadsorption up to the deposition of about 0.5 ML of Cu. At higher conversions the deposition mechanism gradually changes towards bulk Cu deposition, accompanied by reduction of the sulphate coverage.

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“…1b. The potential scan was initiated at −800 mV, and a transition region where adsorbed species are formed at the electrode surface was recorded [23,24]. Several studies have confirmed the adsorption of SO 4 2− ions on smooth and copperized copper surfaces in acid and neutral media [23][24][25].…”

Section: Potentiodynamic Measurementsmentioning

confidence: 96%

The influence of the copper/nickel ratio on the electrochemical behavior of Cu–Ni alloys in acidic sulfate solutions

Badawy

Ismail

Fathi

2009

Journal of Alloys and Compounds

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Radiotracer study of adsorption of HSO−4 and SO2−4 ions on a smooth copper electrode in acid and neutral media

Cited by 43 publications

References 21 publications

Sorption of Sulfate and Chloride Anions on a Well-Characterized Al 2024 Electrode

Sorption of Sulfate and Chloride Anions on a Well-Characterized Al 2024 Electrode

Heat Effects upon Electrochemical Copper Deposition on Polycrystalline Gold

The influence of the copper/nickel ratio on the electrochemical behavior of Cu–Ni alloys in acidic sulfate solutions

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