RAIN: A Tool for Reliability Assessment of Interconnect Networks—Physics to Software

Non-Uniform Temperature Distribution in Interconnects and Its Impact on Electromigration

“…The mean values for the parameters are obtained from recent experimental reports on modern manufacturing processes [4][5][6][7]. This model confirms that for novel technologies [12][13][14][15][16][17], neglecting the temperature evolution and its impact on interconnect reliability and their lifetime may lead to wrong conclusions or catastrophic failures.…”

“…However, the corresponding current and the interconnect width are used appropriately. The mean values for the parameters are obtained from recent experimental reports on modern manufacturing processes of major foundries [4][5][6][7] [13][14][15][16][17]. Due to the space limit, the effects are shown for local interconnects only; similar observations can be made for other layers.…”

“…The segment is then properly constructed in COMSOL Multiphysics [12]. The values for geometrical, electrical, mechanical and thermal properties of technology are obtained from various recent reports of major foundries for 10nm [4][5][6] [13][14][15][16][17]. Via effect which explains the inter-layer heat transfer is also employed for realistic and accurate modeling [1] [9].…”

“…Table 1 shows the application of our model to intermediate-length interconnects in 10nm technology under various thermal profiles (due to Joule heating). The values for geometrical, electrical, mechanical and thermal properties of technology are obtained from [1][2][3] [15][16][17][18][19]. Table 1 present the experiments on two similar wires with lengths of 50um and 100um.…”