Rapid formation of intermetallic joints through ultrasonic-assisted die bonding with Sn–0.7Cu solder for high temperature packaging application

Ji, Hongjun; Qiao, Yunfei; Li, Mingyu

doi:10.1016/j.scriptamat.2015.07.036

Cited by 96 publications

(31 citation statements)

References 36 publications

(60 reference statements)

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“…In addition, the generation of many cavitation bubbles caused by ultrasonic at the bottom of the melt pool was also one of the reasons that deepened the weld penetration. Many previous types of research have confirmed that the collapse of the ultrasonic cavitation bubble would damage the substrate and form erosion pits [29][30][31]. As shown in the weld transverse image of Figure 6e,f, the fusion lines were not smooth, which was different from the weld obtained by conventional welding or ultrasonic-assisted welding method at low output power.…”

Section: Figurementioning

confidence: 79%

Investigating the Advantages of Ultrasonic-assisted Welding Technique Applied in Underwater Wet Welding by in-situ X-ray Imaging Method

Chen

Guo

et al. 2020

Materials

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In this study, the effects of ultrasonic on melt pool dynamic, microstructure, and properties of underwater wet flux-cored arc welding (FCAW) joints were investigated. Ultrasonic vibration enhanced melt flow and weld pool oscillation. Grain fragmentation caused by cavitation changed microstructure morphology and decreased microstructure size. The proportion of polygonal ferrite (PF) reduced or even disappeared. The width of grain boundary ferrite (GBF) decreased from 34 to 10 μm, and the hardness increased from 204 to 276 HV. The tensile strength of the joint increased from 545 to 610 MPa, and the impact toughness increased from 65 to 71 J/mm2 due to the microstructure refinement at the optimum ultrasonic power.

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Section: Figurementioning

confidence: 79%

Investigating the Advantages of Ultrasonic-assisted Welding Technique Applied in Underwater Wet Welding by in-situ X-ray Imaging Method

Chen

Guo

et al. 2020

Materials

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“…Figure 9 shows the eutectic structure observed in detail. The white precipitates are Ag 3 Sn and the black are Cu 6 Sn 5 . The SAC305 shows Ag 3 Sn of smaller size and of a rounder shape than that of the SSA8030.…”

Section: Discussionmentioning

confidence: 99%

“…However, due to a recent environmental regulation for automobiles, i.e., End-of-Life Vehicle (ELV), the use of Pb-containing solders for electrical components was completely prohibited in the European Union (EU), the European Free Trade Association (EFTA), Japan, Korea, and China. Therefore, studies on high-temperature Pb-free solder to substitute for conventional Pb-containing solder have been conducted [5][6][7][8][9][10].…”

Section: Introductionmentioning

confidence: 99%

The Effect of Eutectic Structure on the Creep Properties of Sn-3.0Ag-0.5Cu and Sn-8.0Sb-3.0Ag Solders

Park

Bang

et al. 2017

Metals

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Solder joints are the main weak points of power modules used in harsh environments. For the power module of electric vehicles, the maximum operating temperature of a chip can reach 175 • C under driving conditions. Therefore, it is necessary to study the high-temperature reliability of solder joints. This study investigated the creep properties of Sn-3.0Ag-0.5Cu (SAC305) and Sn-8.0Sb-3.0Ag (SSA8030) solder joints. The creep test was conducted at 175 and 190 • C with the application of 2.45 MPa. The SAC305 solder had superior creep properties to those of SSA8030 solder at 175 • C and at largely the same homologous temperature (T H~0 .91 for SAC305 and T H~0 .92 for SSA8030). Both solders had primary β-Sn and a eutectic mixture of β-Sn and Ag 3 Sn. Compared to SSA8030, the SAC305 solder contained~10% more eutectic structure and contained Ag 3 Sn that was 3 times smaller and more round in shape. Furthermore, the SSA8030 solder precipitated SnSb in an elongated fiber shape (1-50 µm in size) after the creep test. Coarse and elongated Ag 3 Sn and SnSb of the SSA8030 solder negatively affected crack propagation in the dislocation creep region and decreased the creep resistance.

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“…When the soldering time increased up to 87 min as presented in Figure 4d, the continuously coarsened Ni 3 Sn 4 intermetallic penetrated the whole joint cross-section to bridge the two opposite interfaces. The penetrating intermetallic was recently reported to have better electrical conductivity, thermal conductivity, and mechanical property [25]. Furthermore, a small number of voids were found to exist inside the rod-shaped IMCs.…”

Section: Materials Yield Strength (Mpa) Flow Regionmentioning

confidence: 98%

IMCs Microstructure Evolution Dependence of Mechanical Properties for Ni/Sn/Ni Micro Solder-Joints

et al. 2020

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The current miniaturization trend of microelectronic devices drives the size of solder joints to continually scale down. The miniaturized joints considerably increase intermetallic compounds (IMCs) volume fraction to trigger mechanical reliability issues. This study investigated precise relationships between varying IMC volumes and mechanical properties of Ni/Sn(20μm)/Ni micro-joints. A designed method that followed the IMC volume as the only variable was used to prepare micro-joint samples with different IMC volumes. The continuously thickened Ni3Sn4 IMCs exhibited a noticeable morphology evolution from rod-like to chunky shape. The subsequent tensile tests showed unexpected tensile strength responses as increasing Ni3Sn4 volume, which was strongly associated with the Ni3Sn4 morphological evolutions. Fractographic analysis displayed that the ductile fracture dominates the 20%–40% IMC micro-joints, whereas the brittle fracture governs the 40%–80% IMC micro-joints. For the ductile fracture-dominated joints, an abnormal reduction in strength occurred as increasing IMCs volume from 20% to 40%. This is primarily due to severe stress concentrations caused by the transformed long rod-typed morphology of the Ni3Sn4. For the brittle fracture-dominated joints, the strength appeared a monotonous increase as the Ni3Sn4 volume increased. This may be attributed to the increased crack resistance resulting from continuous coarsening of the chunky Ni3Sn4 without any voids. Moreover, the finite element analysis was provided to further understand the joint failure mechanisms.

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Rapid formation of intermetallic joints through ultrasonic-assisted die bonding with Sn–0.7Cu solder for high temperature packaging application

Cited by 96 publications

References 36 publications

Investigating the Advantages of Ultrasonic-assisted Welding Technique Applied in Underwater Wet Welding by in-situ X-ray Imaging Method

Investigating the Advantages of Ultrasonic-assisted Welding Technique Applied in Underwater Wet Welding by in-situ X-ray Imaging Method

The Effect of Eutectic Structure on the Creep Properties of Sn-3.0Ag-0.5Cu and Sn-8.0Sb-3.0Ag Solders

IMCs Microstructure Evolution Dependence of Mechanical Properties for Ni/Sn/Ni Micro Solder-Joints

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