Rapid Thermal Processing

Timans, P. J.

doi:10.1201/9781420017663.ch11

Cited by 4 publications

(5 citation statements)

References 293 publications

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“…Wet chemical 71 , dry reactive ion 72 , and plasma-assisted etching 73 techniques are used to clean and remove material from selected regions of the substrate. Thermal treatments 74–76 at high temperature are often used to add impurities (dopants) into the substrate as well as grow insulating oxide layers on the surface. These techniques are more than sufficient to fabricate hybrid devices required for microfluidic flow cytometers.…”

Section: Fabrication Of Microfluidic Flow Cytometry Devicesmentioning

confidence: 99%

Microfluidic flow cytometry: The role of microfabrication methodologies, performance and functional specification

et al. 2018

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Flow cytometry is an invaluable tool utilized in modern biomedical research and clinical applications requiring high throughput, high resolution particle analysis for cytometric characterization and/or sorting of cells and particles as well as for analyzing results from immunocytometric assays. In recent years, research has focused on developing microfluidic flow cytometers with the motivation of creating smaller, less expensive, simpler, and more autonomous alternatives to conventional flow cytometers. These devices could ideally be highly portable, easy to operate without extensive user training, and utilized for research purposes and/or point-of-care diagnostics especially in limited resource facilities or locations requiring on-site analyses. However, designing a device that fulfills the criteria of high throughput analysis, automation and portability, while not sacrificing performance is not a trivial matter. This review intends to present the current state of the field and provide considerations for further improvement by focusing on the key design components of microfluidic flow cytometers. The recent innovations in particle focusing and detection strategies are detailed and compared. This review outlines performance matrix parameters of flow cytometers that are interdependent with each other, suggesting trade offs in selection based on the requirements of the applications. The ongoing contribution of microfluidics demonstrates that it is a viable technology to advance the current state of flow cytometry and develop automated, easy to operate and cost-effective flow cytometers.

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Section: Fabrication Of Microfluidic Flow Cytometry Devicesmentioning

confidence: 99%

Microfluidic flow cytometry: The role of microfabrication methodologies, performance and functional specification

et al. 2018

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“…Dynamic non-uniformity effects become dominant when very high power heat sources are employed. For example, the recent renaissance in millisecond annealing, where τ is < ~10 ms, has required the use of high-power pulses of energy for selective surface heating that is followed by rapid conductive cooling to the bulk of the wafer [54][55][56][57][58][59][60][61][62][63][64]. Fig.…”

Section: Rapid Thermal Processing and Beyond: Applications In Semicon...mentioning

confidence: 99%

“…This is because of heat transfer along the scanning direction, which causes the peak temperature rise at any given location to be affected by the "history" of the scan across the wafer, including the presence of patterns. The localized nature of the heating also means that adequate process uniformity requires a large overlap between adjacent scans of the laser beam, leading to a fundamental trade-off between uniformity and wafer throughput [54,58]. Pattern effects have also been observed for lamp-based millisecond annealing [61][62][63], even though the wider spectrum of radiation from a flash-lamp does lead to spectral averaging of optical properties.…”

Section: Rapid Thermal Processing and Beyond: Applications In Semicon...mentioning

confidence: 99%

“…In contrast, the degree of pattern effects depends on the heating power used for the millisecond annealing. Hence one can reduce pattern effects by preheating the bulk of a wafer to a high temperature before using a lower power pulse to reach a given peak surface temperature [54][55][56][57][58]. The highest preheating temperature permissible will usually be limited by the thermal budget from the bulk preheating itself.…”

Section: Practical Paths For Handling Pattern Effects In Volume Produ...mentioning

confidence: 99%

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A Short History of Pattern Effects in Thermal Processing

Timans

2008

MSF

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Radiant energy sources enable rapid and controllable thermal processing of wafers with closed-loop control of wafer temperature. However the use of energy sources that are not in thermal equilibrium with the wafers makes the heating process sensitive to the optical properties of the wafers. In particular, patterns on wafer surfaces can cause temperature non-uniformity at length scales where lateral thermal conduction cannot smooth out the effect. Such “pattern effects” are even more significant for advanced processing techniques like millisecond annealing and pulsed laser annealing, because of the extremely large heating powers employed. The issue of pattern effects was recognized early on in the development of radiant heating technology, but has recently become a critical issue for process control. Despite the challenges, many counter-measures can be deployed to minimize pattern effects, including modifications to the wafer design, changes in processing recipe and equipment configuration. Such solutions have enabled the use of radiant heating for even the most demanding device fabrication applications.

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“…Such a progress is driven by advances in the engineering of ultra-thin gate insulators, highmobility channels, ultra-shallow junctions and low-resistance contacts. RTP (Rapid Thermal Processing) is a key process step in providing the essential capabilities for both process and material development on this front [1]. Figure 1 illustrates the important role of RTP in an advanced fabrication process.…”

Section: Introductionmentioning

confidence: 99%

Analyzing electrical effects of RTA-driven local anneal temperature variation

Joshi¹,

Agarwal²,

Sylvester³

et al. 2010

2010 15th Asia and South Pacific Design Automation Conference (ASP-DAC)

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Suppresing device leakage while maximizing drive current is the prime focus of semiconductor industry. Rapid Thermal Annealing (RTA) drives process development on this front by enabling fabrication steps such as shallow juction formation that require a low thermal budget. However, decrease in junction anneal time for more aggresive device scaling has reduced the characteristic thermal length to dimensions less than the typical die size. Also, the amount of heat transferred, and hence the local anneal temperature, is affected by the layout pattern dependence of optical properties in a region. This variation in local anneal temperature causes a variation in performance and leakage across the chip by affecting the threshold voltage (V th ) and extrinsic transistor resistance (R ext ). In this work, we propose a new local anneal temperature variation aware analysis framework which incorporates the effect of RTA induced temperature variation into timing and leakage analysis. We solve for chip level anneal temperature distribution, and employ TCAD based device level models for drive current (Ion) and leakage current (Ioff) dependence on anneal temperature variation, to capture the variation in device performance and leakage based on its position in the layout. Experimental results based on a 45nm experimental test chip show anneal temperature variation of up to ~10.5 o C, which results in ~6.8% variation in device performance and ~2.45X variation in device leakage across the chip. The corresponding variation in inverter delay was found to bẽ 7.3%. The temperature variation for a 65nm test chip was found to be ~8.65 o C.

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Rapid Thermal Processing

Cited by 4 publications

References 293 publications

Microfluidic flow cytometry: The role of microfabrication methodologies, performance and functional specification

Microfluidic flow cytometry: The role of microfabrication methodologies, performance and functional specification

A Short History of Pattern Effects in Thermal Processing

Analyzing electrical effects of RTA-driven local anneal temperature variation

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