2010 15th Asia and South Pacific Design Automation Conference (ASP-DAC) 2010
DOI: 10.1109/aspdac.2010.5419792
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Analyzing electrical effects of RTA-driven local anneal temperature variation

Abstract: Suppresing device leakage while maximizing drive current is the prime focus of semiconductor industry. Rapid Thermal Annealing (RTA) drives process development on this front by enabling fabrication steps such as shallow juction formation that require a low thermal budget. However, decrease in junction anneal time for more aggresive device scaling has reduced the characteristic thermal length to dimensions less than the typical die size. Also, the amount of heat transferred, and hence the local anneal temperatu… Show more

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Cited by 5 publications
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“…Thus, the DIBL value of the device with the non-annealed ohmic contact was considerably lower than that of a conventional device with an annealed ohmic contact, owing to the reduced dopant diffusion. 22) In addition, an excellent minimal SS of 69 mV=decade was obtained for the E-mode device at V DS = 0.5 V, as shown in Fig. 3(a), representing a fast switch transition.…”
mentioning
confidence: 75%
“…Thus, the DIBL value of the device with the non-annealed ohmic contact was considerably lower than that of a conventional device with an annealed ohmic contact, owing to the reduced dopant diffusion. 22) In addition, an excellent minimal SS of 69 mV=decade was obtained for the E-mode device at V DS = 0.5 V, as shown in Fig. 3(a), representing a fast switch transition.…”
mentioning
confidence: 75%