Rapid whisker growth on the surface of Sn–3Ag–0.5Cu–1.0Ce solder joints

Chuang, Tung‐Han

doi:10.1016/j.scriptamat.2006.08.024

Cited by 69 publications

(41 citation statements)

References 10 publications

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“…The results of Chuang and co-authors [19][20][21][22] on the whiskering behavior of RE-containing solders contrast slightly with the results of this study. For example, in a study conducted on Sn-6.6RE (RE = Ce, La, and Lu), they observed that the La-containing alloy whiskered less than alloys containing Ce and Lu.…”

Section: Microstructure Evolution During Oxidationcontrasting

confidence: 95%

“…SnO 2 and SnO were also not detected. Chuang 19 observed that CeSn 3 oxidizes to form crystalline CeO 2 . It is possible, however, that at low temperatures and under certain oxidizing conditions the oxide phases that form on intermetallics can be ''weakly crystalline'' or possibly amorphous.…”

Section: Microstructure Evolution During Oxidationmentioning

confidence: 99%

“…In the case of La-containing solders, oxidation leads to degradation in the mechanical performance as well as poor reflow quality. 18 Chuang and co-authors [19][20][21][22] have shown that a significant amount of Sn whiskering takes place on the surfaces of Pb-free solders containing Ce, La, and Lu. Similar observations have been made by Jiang and Xian 23 with solders containing Nd.…”

Section: Introductionmentioning

confidence: 99%

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Oxidation Behavior of Rare-Earth-Containing Pb-Free Solders

Dudek

Chawla

2008

Journal of Elec Materi

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We have previously shown that small additions of the rare-earth (RE) element La to Sn-Ag-Cu alloys significantly increases their ductility, without significant loss in the overall strength. However, due to the high reactivity of La with oxygen, oxidation of the La-containing phases can affect the mechanical performance of the solder. In this work, we have investigated the effect of the addition of 2 wt.% Ce, La and Y on the oxidation behavior of Sn-3.9Ag-0.7Cu. Oxidation kinetics were established by heating samples in ambient air to 60°C, 95°C or 130°C for up to 250 h. Microstructural characterization of the samples, before and after oxidation, was conducted in order to determine the influence of RE-containing phases on the oxidation kinetics. The oxidation mechanism, including the phenomenon of Sn whiskering during oxidation, is also discussed.

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Section: Microstructure Evolution During Oxidationcontrasting

confidence: 95%

Section: Microstructure Evolution During Oxidationmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Oxidation Behavior of Rare-Earth-Containing Pb-Free Solders

Dudek

Chawla

2008

Journal of Elec Materi

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“…However, recently, there have been several reports [10][11][12][13] that show whisker growth from the surface of the bulk Sn alloys doped with RE. For example, Chuang et al reported whisker growth from Sn-3Ag-0.5Cu-1.0Ce, 10 Sn-3Ag-0.5Cu-0.5Ce, 11 and Sn-6.6Lu 12 alloys; Jiang and Xian 13 reported the spontaneous growth phenomenon of tin whiskers from Sn-Nd alloys.…”

Section: Introductionmentioning

confidence: 99%

“…For example, Chuang et al reported whisker growth from Sn-3Ag-0.5Cu-1.0Ce, 10 Sn-3Ag-0.5Cu-0.5Ce, 11 and Sn-6.6Lu 12 alloys; Jiang and Xian 13 reported the spontaneous growth phenomenon of tin whiskers from Sn-Nd alloys. Since a tin whisker is a conductive metal wire, it can cause a short-circuit 14 in high density electronic packaging and can even result in a catastrophic event.…”

Section: Introductionmentioning

confidence: 99%

Tin Whisker Growth on the Surface of Sn-0.7Cu Lead-Free Solder with a Rare Earth (Nd) Addition

Xian

2009

Journal of Elec Materi

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The phenomenon of rare earth (RE) additions inducing whisker growth in Sn-0.7Cu-Nd (0.1-5 wt.%Nd) solder is reported. The results showed that Nd exists as Sn 3 Nd in the microstructure of the solder alloys. A snowflake-like Sn 3 Nd was observed when Nd £ 0.5 wt.%. After exposure to ambient conditions, the Nd-bearing alloys have a strong tendency toward whisker growth, with a short incubation time for whisker nucleation (only several hours). All whiskers originated from the Sn-Nd compound, where whiskers grew relatively fast; the average growth rate of the five longest whiskers was approximately 4 Å /s, and a 190 lm whisker was observed within 480 h. Based on these results, it was predicted that whisker growth would be inevitable for all RE-bearing solders. The cause of this phenomenon is also discussed. Finally, the authors suggest that any solders doped with RE should be carefully considered again.

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Tin Whiskers

Vicenzo¹

2011

The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects

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Rapid whisker growth on the surface of Sn–3Ag–0.5Cu–1.0Ce solder joints

Cited by 69 publications

References 10 publications

Oxidation Behavior of Rare-Earth-Containing Pb-Free Solders

Oxidation Behavior of Rare-Earth-Containing Pb-Free Solders

Tin Whisker Growth on the Surface of Sn-0.7Cu Lead-Free Solder with a Rare Earth (Nd) Addition

Tin Whiskers

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