2005 IEEE Workshop on Microelectronics and Electron Devices, 2005. WMED '05. 2005
DOI: 10.1109/wmed.2005.1431607
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RDL manufacturing for flip chip packaging

B. Williams
1
,
D. Florence
2
,
H. Dalai
3
et al.
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Heterogeneous 2.5D integration on through silicon interposer

Zhang1,
Lin2,
Wickramanayaka3
et al. 2015
Applied Physics Reviews
130
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Heterogeneous 2.5D integration on through silicon interposer

Zhang1,
Lin2,
Wickramanayaka3
et al. 2015
Applied Physics Reviews
130
0
34
0
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EquiNox: Equivalent NoC Injection Routers for Silicon Interposer-Based Throughput Processors

Li
1
,
Chen
2
2020
2020 IEEE International Symposium on High Performance Computer Architecture (HPCA)
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High Speed SerDes Design on FOCoS with Thick RDL

Hung
1
,
Wu
2
,
Kuo
3
et al. 2020
2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
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