Re-examination on thermal stresses of bonded structures

Abstract

To the authors' best knowledge this is the ®rst time that the photoelastic method has been used to determine experimentally the whole-®eld state of thermal stresses of bonded structures. Except for the immediate vicinity of the interfacial edges, the photoelastic results were con®rmed through the ®nite element method (FEM). Theoretical solutions provided by both Timoshenko and Suhir were then re-examined and compared with the photoelastic and FEM results. A comparison of those results indicated that the current theoretical solutions are oversimpli®ed and need to be improved.

Transient thermal stress intensity factors of bimaterial interface cracks using refined three-fringe photoelasticity

“…A major concern in such bimaterials is the mismatch in thermal coefficients of expansion of the constituent materials, which gives rise to thermal stress in addition to the stress due to mechanical loading. Bimaterial strips are the simplified models used in the literature for experimental and theoretical analysis of electronic packages and bimetal thermostats [1]. Photoelasticity [1][2][3] and moiré interferometry [4,5] have been used to analyse the steady state thermal stresses in bimaterial strips.…”

“…Bimaterial strips are the simplified models used in the literature for experimental and theoretical analysis of electronic packages and bimetal thermostats [1]. Photoelasticity [1][2][3] and moiré interferometry [4,5] have been used to analyse the steady state thermal stresses in bimaterial strips. During thermal cycling of bimaterial specimens, the induced thermal stresses are predominant near the edges of the interface, which may eventually cause fatigue failure by initiating interface edge cracks [6].…”

Investigation of Analytical Solutions for Bonded Structures by Photomechanical Methods

“…Recently, the authors [7, 8] first showed the respective shortcomings of Suhir's 1986 and 1989 theories by both digital photoelasticity and finite element method (FEM). The results indicated that Suhir's 1986 theory is only suitable to predict the distribution of interfacial shearing stress but not the interfacial peeling stress.…”

“…In the authors’ earlier work [7–9], the emphases were given on the investigation of distributions of interfacial stresses. Thermal stresses of adherends and lateral displacement of bonded structures were sparingly discussed.…”

<title>Experimental investigation of vibration behaviors of bonded structures</title>

“…In the literature, the emphases of bonded structures were almost all given on the investigation of mechanical behaviors of bonded structures under either thermal or static mechanical loading [1][2][3][4][5]. However, in many occasions, the large amplitude excited at the resonant frequency also leads to the catastrophic failure of bonded structures especially when the flaws are existed in the bonded structures.…”