Reaction of Sn-3.5Ag-0.7Cu-xSb solder with Cu metallization during reflow soldering

Li, G.Y.; Chen, B.L.; Tey, Ju Nie

doi:10.1109/tepm.2004.830507

Cited by 42 publications

(14 citation statements)

References 20 publications

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“…Compared with the data given in our previous investigation, 16 the activation energies of the Cu 6 Sn 5 layer in the solder joints with different Sb concentrations show a similar trend, i.e., the Sb-free solder joint has the lowest activation energy (30.26 kJ/mol), and when 0.2 wt.% Sb is added, the activation energy is increased to 33.18 kJ/mol. When 0.8 wt.% Sb is added, the activation energy is increased to the highest value of 43.05 kJ/mol.…”

Section: Kinetics Of the Imc Formationsupporting

confidence: 65%

Influence of Dopant on Growth of Intermetallic Layers in Sn-Ag-Cu Solder Joints

Bi²,

Chen

et al. 2010

Journal of Elec Materi

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The interfacial interaction between Cu substrates and Sn-3.5Ag-0.7Cu-xSb (x = 0, 0.2, 0.5, 0.8, 1.0, 1.5, and 2.0) solder alloys has been investigated under different isothermal aging temperatures of 100°C, 150°C, and 190°C. Scanning electron microscopy (SEM) was used to measure the thickness of the intermetallic compound (IMC) layer and observe the microstructural evolution of the solder joints. The IMC phases were identified by energy-dispersive x-ray spectroscopy (EDX) and x-ray diffractometry (XRD). The growth of both the Cu 6 Sn 5 and Cu 3 Sn IMC layers at the interface between the Cu substrate and the solder fits a power-law relationship with the exponent ranging from 0.42 to 0.83, which suggests that the IMC growth is primarily controlled by diffusion but may also be influenced by interface reactions. The activation energies and interdiffusion coefficients of the IMC formation of seven solder alloys were determined. The addition of Sb has a strong influence on the growth of the Cu 6 Sn 5 layer, but very little influence on the formation of the Cu 3 Sn IMC phase. The thickness of the Cu 3 Sn layer rapidly increases with aging time and temperature, whereas the thickness of the Cu 6 Sn 5 layer increases slowly. This is probably due to the formation of Cu 3 Sn at the interface between two IMC phases, which occurs with consumption of Cu 6 Sn 5 . Adding antimony to Sn-3.5Ag-0.7Cu solder can evidently increase the activation energy of Cu 6 Sn 5 IMC formation, reduce the atomic diffusion rate, and thus inhibit excessive growth of Cu 6 Sn 5 IMCs. This study suggests that grain boundary pinning is one of the most important mechanisms for inhibiting the growth of Cu 6 Sn 5 IMCs in such solder joints when Sb is added.

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Section: Kinetics Of the Imc Formationsupporting

confidence: 65%

Influence of Dopant on Growth of Intermetallic Layers in Sn-Ag-Cu Solder Joints

Bi²,

Chen

et al. 2010

Journal of Elec Materi

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“…7,8 Recently, many studies have been conducted to solve the problems as well as accomplish more stable and reliable solder joints by adding fourth alloying elements to SAC solder alloys, such as Ni, 9 Ti, 9 Mn, 9 Co, 9,14 Bi, 10 Sb, 11 Zn, [12][13][14] Fe, 14 and In-Ni. 14 Kim et al reported that when 0.1 wt.% X (X = Ni, Ti, Mn and Co) was added to Sn-3.0Ag-0.5Cu solder alloys, the fourth alloying elements improved the microstructure and reduced the undercooling, recommending the SAC-0.1Ni solder alloy as an optimum composition.…”

Section: Introductionmentioning

confidence: 99%

“…IMCs growth on Cu UBM was reduced as the Sb content increased. 11 Kang et al reported that when 0.1 wt.% and 0.7 wt.% Zn were added to Sn-3.8Ag-0.7Cu, the undercooling dramatically decreased from 29.8°C to 3-4°C and, as a result, the formation of large Ag 3 Sn plates was controlled. In addition, they observed that the Zn addition (0.7 wt.%) also affected the suppression of IMCs growth on Cu pads.…”

Section: Introductionmentioning

confidence: 99%

Effects of Minor Additions of Zn on Interfacial Reactions of Sn-Ag-Cu and Sn-Cu Solders with Various Cu Substrates during Thermal Aging

Cho

Kang

Shih

et al. 2007

Journal of Elec Materi

131

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The effects of Zn additions to Sn-0.7Cu and Sn-3.8Ag-0.7Cu (all in wt.% unless specified otherwise) Pb-free solders on the interfacial reactions with Cu substrates were investigated. The study was focused on the intermetallic compound (IMC) growth, Cu consumption and void formation as a function of thermal aging and solder composition. Four different kinds of Cu substrates (high-purity Cu, oxygen-free Cu, vacuum-sputtered Cu, and electroplated Cu) were prepared to compare their interfacial reaction behaviors with Zn-added solders. Thermal aging was performed at 150°C for up to 1000 h to accelerate the interfacial reactions between solders and Cu substrates. Growth of IMCs (Cu 6 Sn 5 and Cu 3 Sn) in Zn-added solders was slower than those without Zn additions. The growth of the Cu 3 Sn phase, in particular, was drastically reduced in the Zn-added solders on all four Cu substrates. On an electroplated Cu substrate, numerous voids were observed in the Cu 3 Sn phase for Sn-Cu and Sn-Ag-Cu solders aged at 150°C for 1000 h. However, these voids were largely eliminated in the Zn-added solders. On the other three Cu substrates, the conditions which produce a high density of voids were not found after aging both solders with and without Zn. The Cu consumption with Zn-added solders was also significantly lower. The beneficial effects of Zn additions on interfacial reaction behaviors are reported, and the corresponding mechanisms in suppressing void formation and Cu consumption due to Zn additions will be discussed.

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“…Both the IMC thickness and grain growth exponents are used to describe the kinetics of IMC growth because the IMC growth in reflow process involves two different growth kinetics processes [13,14]. One is the IMC formation and growth controlled by interfacial reaction and atomic interdiffusion, and another is the grain ripening growth controlled by volume diffusion.…”

Section: Growth Kinetics Of the Imc Formationmentioning

confidence: 99%

Size effect on IMC growth in micro-scale Sn-3.0Ag-0.5Cu-0.1TiO2 solder joints in reflow process

et al. 2016

Journal of Alloys and Compounds

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Reaction of Sn-3.5Ag-0.7Cu-xSb solder with Cu metallization during reflow soldering

Cited by 42 publications

References 20 publications

Influence of Dopant on Growth of Intermetallic Layers in Sn-Ag-Cu Solder Joints

Influence of Dopant on Growth of Intermetallic Layers in Sn-Ag-Cu Solder Joints

Effects of Minor Additions of Zn on Interfacial Reactions of Sn-Ag-Cu and Sn-Cu Solders with Various Cu Substrates during Thermal Aging

Size effect on IMC growth in micro-scale Sn-3.0Ag-0.5Cu-0.1TiO2 solder joints in reflow process

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