Size effect on IMC growth in micro-scale Sn-3.0Ag-0.5Cu-0.1TiO2 solder joints in reflow process

Li, Z.L.; Li, G.Y.; Li, B.; Cheng, LanXian; Huang, Jiaqiang; Tang, Yu

doi:10.1016/j.jallcom.2016.06.295

Cited by 25 publications

(8 citation statements)

References 27 publications

Supporting

Mentioning

Contrasting

Unclassified

Order By: Relevance

“…Huang et al [33] measured the IMC evolution of Sn3.0Ag0.5Cu solder joints on Cu or Ni-P pads, and the Cu flux variation was inferred to be the cause of solder volume size effects. Li et al [34] performed experiments and simulations regarding the Cu concentration effect on different sizes of Sn3.0Ag0.5C0.1TiO 2 /Cu solder joints, and concluded that the IMC formation may not simply obey diffusion-controlled or interfacial reaction-controlled growth, but was instead a combination of both. Compared with bulk diffusion, surface diffusion and intergranular diffusion are fast diffusion channels.…”

Section: Solidification and Recrystallization In The Solder Matrixmentioning

confidence: 99%

“…Wang et al [56] developed a theoretical model based on the local stress singularity at the bi-material corner to analyze the relationship between the microstructure size and macro-fracture toughness of lead-free solder joints. The IMC grain size effect on the fracture toughness of solder joints was stated as follows [34]:…”

Section: Fracture and Creep Deformation Of Solder Jointsmentioning

confidence: 99%

See 1 more Smart Citation

Critical Review of Size Effects on Microstructure and Mechanical Properties of Solder Joints for Electronic Packaging

2019

View full text Add to dashboard Cite

With the miniaturization of electronic packaging and devices, the size of solder joints in electronics is also decreasing from bulk solder joints to micro-bumps. Both the microstructure and mechanical properties of the solder joints are also evolving with the decreasing size, which brings great concern for the reliability of different sizes of solder interconnections. In this paper, the effect of solder size on the microstructure (i.e., interfacial intermetallic compound (IMC) growth, precipitation in the solder matrix, dendrite arms, and undercooling) and mechanical properties (i.e., tensile property, shear and compression strength, fracture toughness, and creep deformation) are reviewed from the mechanical point of view. In addition, some areas for further researches about size effects on solder joints are discussed.

show abstract

Section: Solidification and Recrystallization In The Solder Matrixmentioning

confidence: 99%

Section: Fracture and Creep Deformation Of Solder Jointsmentioning

confidence: 99%

Critical Review of Size Effects on Microstructure and Mechanical Properties of Solder Joints for Electronic Packaging

2019

View full text Add to dashboard Cite

show abstract

“…Sambungan pateri yang baik adalah penting untuk memastikan kebolehfungsian sesuatu produk elektronik. Walau bagaimanapun, sekiranya lapisan IMC yang terlalu tebal, kerapuhan lapisan IMC akan mengakibatkan kegagalan sambungan dan kebolehharapan yang rendah, seterusnya menyebabkan komponen elektronik tidak dapat berfungsi (Li et al 2016). Lantaran itu, kebanyakan kajian lepas telah menambahbaik sifat antaramuka pateri contohnya dengan menggunakan karbon nanotiub (CNT) bagi merencatkan pertumbuhan IMC (Mayappan et al 2016).…”

Section: Pengenalanunclassified

Kesan Pigmen Pewarna terhadap Pertumbuhan Sebatian antara Logam Sambungan Pateri Sn-3.0Ag-0.5Cu

Jalar¹,

Bakar

Ismail

et al. 2018

JSM

View full text Add to dashboard Cite

Pewarnaan pes pateri membuka suatu ruang kepada keperluan dalam teknologi untuk proses pengenalpastian, penandaan, piawaian, pengujian dan penilaian terhadap antarasambungan pes pateri. Dua jenis pigmen pewarna iaitu hijau (G) dan bercahaya dalam gelap (GD) digunakan untuk mengkaji kesan pewarnaan sambungan pateri ke atas kestabilan antarasambungan pateri Sn-3.0Ag-0.5Cu (SAC 305). Pes pateri tanpa warna digunakan sebagai sampel kawalan untuk membandingkan keputusan kajian. Uji kaji penuaan sesuhu digunakan untuk melihat perubahan pertumbuhan sebatian antara logam (IMC). Pigmen pewarna GD dengan peratusan sebanyak 5% telah menunjukkan kestabilan pertumbuhan IMC dengan perubahan pertumbuhan yang paling rendah iaitu sebanyak 5.6 µm bagi sambungan pateri yang berwarna berbanding dengan peratusan pigmen pewarna yang lebih tinggi dengan perubahan pertumbuhan IMC sehingga 9 µm selepas didedahkan kepada penuaan sesuhu pada 150°C selama 1000 jam. Walau bagaimanapun, kestabilan pertumbuhan IMC dengan penggunaan pes pateri berwarna adalah lebih rendah berbanding dengan pes pateri tidak berwarna. Maka penambahan pigmen pewarna hendaklah dipertimbangkan dengan mengambil kira kestabilan mikrostruktur dan pertumbuhan lapisan IMC supaya tidak menjejaskan kualiti dan kebolehharapan sesuatu sambungan pateri.

show abstract

“…An appropriate thickness of the IMC formed is the key for sustaining the reliability of the solder joints. However, IMC is brittle in nature and excessive formation can cause the weakening of joint strength [2]. Another factor that can affect the solder joint's reliability is the equivalent inelastic strain and stress accumulation.…”

Section: Introductionmentioning

confidence: 99%

Effect of Solder Ball Geometry on Solder Joint Reliability under Solder Reflow Cooling Process

et al. 2022

View full text Add to dashboard Cite

Solder joint reliability has become an increasingly important factor in electronic industries to obtain sustainable and reliable electronic packages. The simulation study of 3D finite elements on BGA test assembly models with geometries of SMD-NSMD and NSMD-NSMD is conducted through ABAQUS software and is applied with Anand model equation. The applied loading onto the test assembly is set with reflow cooling temperature of 220 °C to 25 °C. The purpose of this research is to obtain the package warpage, stress, and inelastic equivalent strain throughout the package and solder joints and to develop a predictive finite element model for mechanics and deformation of solder joint in BGA package under reflow cooling. The results obtained showed that solder joints with NSMD-NSMD pad geometry has a greater inelastic equivalent strain and has a greater potential in failing than SMD-NSMD pad geometry. Therefore, it can be concluded that SMD-NSMD pad geometry is more preferable for obtaining a more reliable solder joint.

show abstract

Size effect on IMC growth in micro-scale Sn-3.0Ag-0.5Cu-0.1TiO2 solder joints in reflow process

Cited by 25 publications

References 27 publications

Critical Review of Size Effects on Microstructure and Mechanical Properties of Solder Joints for Electronic Packaging

Critical Review of Size Effects on Microstructure and Mechanical Properties of Solder Joints for Electronic Packaging

Kesan Pigmen Pewarna terhadap Pertumbuhan Sebatian antara Logam Sambungan Pateri Sn-3.0Ag-0.5Cu

Effect of Solder Ball Geometry on Solder Joint Reliability under Solder Reflow Cooling Process

Contact Info

Product

Resources

About